Cray Incorporated

Hewlett Packard Enterprise Development LP

Silicon Graphics, Incorporated

Eric Lakin

Gregory W Pautsch

Kent T McDaniel

Corey Knudsen

Wade J Doll

Perry D Franz

James Joseph Jirak

Rob J Rongstad

Bradley J Smith

Dale Sand

Paul Bonstrom

To achieve multiple benefits, a high speed computing system is configured in a hierarchical manner with flexibility and re-configurability concerns maximized. This begins with a particular cabinet architecture which is specifically designed to accommodate various needs and considerations. The cabinet or rack is designed to receive various chassis assemblies depending on the particular needs and or functions involved. These may include a compute chassis, a switch chassis, or a rectifier chassis, which can be incorporated into the cabinet. Within each chassis, specific components are then inserted, with each of these components being in a subsystem configuration. For example, the compute chassis is specifically designed to receive a number of compute blades. Similarly, the switch chassis is designed to receive a number of switch blades. Lastly, the rectifier chassis is configured to receive a number of rectifiers. Collectively, the multiple blades and chassis are all configured to cooperate with one another in an efficient manner. While various subassemblies are utilized, the cabinet or rack does accommodate certain centralized functions such as cooling and power distribution.

Flexible and adaptable computing system infrastructure

A system and method for cooling a plurality of electronics cabinets having horizontally positioned electronics assemblies. The system includes at least one blower configured to direct air horizontally across the electronics assemblies, and at least one intercooler configured to extract heat from the air flow such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. A plurality of chassis backplanes and power supplies may also include an intercooler, wherein the intercoolers are electronically controlled such that the system is room neutral.

Transverse cooling system and method

A system and method for cooling a plurality of connectors interfacing electrical and optical signals to circuit boards in an electronics cabinet, such as backplane connectors routing signals to circuit boards housed in card cage assemblies. Heat pipes coupled to the connectors efficiently remove heat from the connectors and sink the connector heat to a cold junction of a liquid cooling system, which cooling system may also extract heat from air flow cooling the circuit boards such that the system is room neutral, meaning that the ambient temperature remains constant during operation of the system. The heat connector cooling system is effective where connectors are outside of an air flow cooling envelope that may cool the circuit boards.

Rack mounted electronics having connectors with heat cooling fingers

A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.

System and method for cooling electronic components

Growing community of inventors

Chippewa Falls, WI, United States of America

Eric Lakin