Inotera Memories, Inc.

Eric Lahaug

Chia-Ming Yang

Regan Stanley Tsui

The present disclosure provides a wafer that can be used in coating films. The wafer includes a front surface, a back surface opposite to the front surface, and a plurality of trenches. The back surface further includes a central region and a surrounding region. The trenches are disposed on the back surface. The spacing between any two adjacent trenches in surrounding region is less than the spacing between any two adjacent trenches in the central region.

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Bristow, VA, United States of America

Eric Lahaug