3M Innovative Properties Company

Microelectronics and Computer Technology Corporation

Eric L Zilley

Robert C Jordan

John M Muggee

Diana C Duane

A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.

Copper/epoxy structures

A novel, fast-bonding adhesive composition is disclosed having low odor, and when cured, forms adhesive bonds having high glass transition temperature, T.sub.g, and high shear strength at elevated temperatures. The composition comprises one or more of acryl- and methacrylamides which have a cyclic group directly attached to the amide nitrogen or has the amide nitrogen as a member of a cyclic group. The composition further comprises a polymeric toughener that is dissolved or dispersed in the composition.

Growing community of inventors

Saint Paul, MN, United States of America

Eric L Zilley