Varian Associates, Inc.

Ensurg, Inc.

Zymet, Inc.

Eric L Mears

Richard John Hertel

Robert V Brick

Robert E Jennings

Peter H Rose

Avrum Freytsis

Edward D MacIntosh

Adrian C Delforge

Keith D Pierce

Akhil Bhargava

Carl J Holt, Jr

A ligating band dispenser capable of retraction during movement and exploration to offer an improved field of view for an image sensing device of a hosting endoscope as well as extension to facilitate a conventional ligating procedure.

Movable ligating band dispenser

A ligating band dispenser includes a cylindrical inner sleeve and at least a partially encompassing balloon, where the inner sleeve supports one or more expanded ligating bands external to the balloon. This ligating band dispenser allows the introduction of a pressurized fluid between the inner sleeve and the balloon, proximal to a distal-most, stored ligating band, to effect the distal displacement and dispensing of one or more stored ligating bands.

Balloon actuated ligating band dispenser

A ligating band dispenser has a first sleeve, to store one or more ligating bands, and a second member, which at least partially extends about and is movable relative to the first sleeve. The second sleeve is capable of engaging and moving a distal-most ligating band positioned on the first sleeve from an initial storage position to a dispensing position, irrespective of other ligating bands which may be stored thereon.

Ligating band dispenser

A device for dissolving friable or coagulated tissue within a human body is provided, such lysing operation being achieved through high-speed rotation of at least one thread- or ribbon-like lysing member. Lysing is achieved through shear and/or wear. A flexible drive member, used to rotate the at least one lysing member, may be received within an encompassing, static flexible member. Interaction between the rotating flexible drive member and the encompassing static flexible member causes at least lysed tissue to be pumped and further dissolved along the encompassed length of the flexible drive member.

Medical device for dissolution of tissue within the human body

A ligating band is formed so as to have a pre-stress compression along its inner periphery and a pre-stress tension along its outer periphery at a free state, wherein all the material of the band is at a substantially equal tension when the band is subject to full circumferential expansion. In a free state, the inner periphery can buckle, at least partially filling an inner perimeter defined by the inner periphery with a plurality of material folds.

Ligating structure having greater stretchability, greater shelf life,

A self-disposing ligating band dispenser is formed of a member having predisposed windings, where the windings form a surface to support one or more expanded ligating bands. The wound member has a free portion which enables a properly oriented displacement of the free portion to effect the unwinding of the dispenser, and the dispensing of one or more stored ligating bands.

Self-disposing ligating band dispenser

A ligating band dispenser capable of retraction during movement and exploration to offer an unimpaired field of view for an image sensing device of a hosting endoscope as well as extension to facilitate a conventional ligating procedure. Actuating the ligating band dispenser is accomplished with an actuating mechanism that includes a controller to enable a user to selectively dispense one or more ligating bands and/or retract/extend the dispenser.

Movable ligating band dispenser and method

A device for releaseably holding a workpiece includes a resilient collet which is attached to a base by an elastomeric member. Typically, the collet is an annular ring. Several fingers for holding the workpiece extend from the collet. The fingers are pivoted by actuating a member which elastically deforms the collet and causes the fingers to pivot from a position for engaging the workpiece to a position for releasing the workpiece and vice-versa. In one application, the base is a platen for supporting a wafer in a semiconductor processing system, and a plurality of the holding devices are arranged around the periphery of a rotating disk. A counterweight ring is attached to the collet to counterbalance the moment generated by the centrifugal force of the wafer pressing against the fingers as the disk is rotated.

Apparatus for retaining wafers

Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicon rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.

Methods and apparatus for fabricating a high purity thermally-conductive

Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicone rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silcone rubber layer.

Methods for thermal transfer with a semiconductor

A load chamber of a load lock is provided with a vertical air curtain which isolates the load chamber from the general clean room environment. Horizontal air flows generated in the load chamber bathe wafers held horizontally in the chamber with filtered air. These horizontal air flows are captured by the air curtain and recirculated to filters which provide horizontal and vertical air flows in the load chamber. If desired, the vertical and horizontal flows may be driven by the air supply mechanism of the clean room itself.

Horizontal laminar air flow work station

A mechanical scanning system for a batch ion implanter includes a disk for mounting wafers at sites near its periphery and a disk drive assembly for rotating the disk. The disk and the disk drive assembly are supported in an end station vacuum chamber by a scan arm which extends through a sealed opening in an access door. A scan drive assembly attached to the access door scans the scan arm and the disk in an arc-shaped path. Simultaneous rotation and scanning of the disk cause the ion beam to be distributed over the surfaces of the wafers mounted on the disk. A pivot drive assembly rotates the scan arm and the disk about a pivot axis between an implant position and a load/unload position. The implant angle can be changed without opening or venting the vacuum chamber by loosening the attachment of the scan drive assembly to the access door and rotating the scan drive assembly, the scan arm and the disk about the pivot axis. The access door can be moved on rails to an open position for access to the disk.

Disk scanning apparatus for batch ion implanters

Wafer transfer apparatus for horizontal transfer of a wafer between a cassette and an input station of a vacuum processing system includes a wafer transfer arm with a primary section linked to a secondary section so as to move a wafer in a straight line to a location and orientation station and then to the input station. The actual location of the wafer center and the angular orientation of the wafer flat are determined, and the wafer is rotated to a desired angular orientation at the location and orientation station. A solar cell is used to sense actual wafer position by sensing the wafer edge as it is rotated. The required correction and rotation are calculated from the solar cell output. As the wafer is transferred to the input station, correcting displacements are added to the movement so that the wafer is accurately positioned at the input station. A strain gauge is used to reliably sense wafer presence or absence on the transfer arm.

Wafer transfer system

Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicone rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.

Methods and apparatus for thermal transfer with a semiconductor wafer in

A device for releaseably holding a workpiece includes a resilient collet which is pivotally attached to a base. Several fingers for holding the workpiece extend from the collet. The fingers are pivoted by actuating a member which elastically deforms the collet and causes the fingers to pivot from a position for engaging the workpiece to a position for releasing the workpiece and vice-versa. In one application, the base is a platen for supporting a wafer in a semiconductor processing system and a plurality of such platens and a corresponding plurality of the holding devices are arranged around the periphery of the disk. A counterweight ring is attached to the ring-shaped collet to counter-balance the moment generated by the centrifugal force of the wafer pressing against the fingers as the disk is rotated.

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Rockport, MA, United States of America

Eric L Mears