Silicon Light Machines Corporation

Glimmerglass Networks, Inc.

Interconnect Devices, Inc.

Eric L Bogatin

Bryan P Staker

Dave B Corbin

Douglas L Teeter

David W Henry

Donald A Marx

A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.

Probe array wafer

An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Electro ceramic components

Method for manufacturing electro ceramic components

A method of and an apparatus for electrically interconnecting two integrated circuits devices includes mounting the two devices face to face. A first device is mounted for example to a substrate or lead frame. The first device includes a plurality of electrical/physical mounting structures preferably positioned along one edge. The mounting structure provide both electrical interconnection and physical mounting. A second device includes a corresponding plurality of mounting structures configured as a mirror image of the mounting structures on the first device. The mounting structures on the second device are also positioned along one of its edges so that once the mounting structures are brought together in a face to face relationship, the second device cantilevers off the edge of the first device. Under certain circumstances, a dummy block can be mounted to the substrate adjacent to the first device to act as a strut or support for the second device. The mounting structures can be positioned sufficiently close to one another that surface area consumed for I/O is minimized. Another set of electrical interconnect structures can be formed on the surface of the second device on the edge opposite the mounting structures. Electrical connection can be formed to these electrical interconnect structures using conventional techniques such as tape automated bonding.

Electrical interface to integrated circuit device having high density I/O count

Method of producing an electrical interface to an integrated circuit

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Olathe, KS, United States of America

Eric L Bogatin