Veeco Precision Surface Processing LLC

Veeco Instruments Inc.

Eric Kurt Zwirnmann

John Taddei

Laura Mauer

David A Goldberg

John Clark

Elena Lawrence

Jonathan Yutkowitz

James Swallow

David Golberg

A system and method for performing a wet etching process is disclosed. The system includes multiple processing stations accessible by a transfer device, including a measuring station to optically measure the thickness of a wafer before and after each etching steps in the process. The system also includes a controller to analyze the thickness measurements in view of a target wafer profile and generate an etch recipe, dynamically and in real time, for each etching step. In addition, the process controller can cause a single wafer wet etching station to etch the wafer according to the generated etching recipes. In addition, the system can, based on the pre and post-etch thickness measurements and target etch profile, generate and/or refine the etch recipes.

Two etch method for achieving a wafer thickness profile

An apparatus and method are provided to: determine a unique profile to etch each wafer, execute that etch, and determine and deliver the proper chemical addition in order to maintain etch rate within tight tolerances.

Apparatus and method to control etch rate through adaptive spiking of chemistry

Method of etching the back of a wafer to expose TSVs

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Horsham, PA, United States of America

Eric Kurt Zwirnmann