Alien Technology Corporation

Eric Kanemoto

Mark Alfred Hadley

Scott John Herrmann

Lily Liong

Paul Stephen Drzaic

Gordon S W Craig

Kenneth David Schatz

Glenn Wilhelm Gengel

Eric Snyder

Susan Swindlehurst

Ali A Tootoonchi

John Berhard Hattick

Gordon Samuel Wiggins Craig

Gordon Craig

An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

Assembly comprising functional block deposited therein

An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

Creating recessed regions in a substrate and assemblies having such recessed regions

Methods and apparatuses for the protection of radio frequency identification (RFID) devices are described. In one aspect, a static dissipative material is applied to a web of antenna structures. A coating of the static dissipative material is applied continuously across a plurality of antenna structures of a roll of the web material. An RFID integrated circuit (IC) is attached to the web of antenna structures with the dissipative coating, then subsequently tested on the roll. Additional processing is performed to the RFID tag to produce an RFID label.

Radio frequency identification static discharge protection

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San Jose, CA, United States of America

Eric Kanemoto