Nxp B.v.

Nxp Usa, Inc.

Eric Johnson

Kevin Kim

Roy McLaren

Vikas Shilimkar

Richard Emil Sweeney

Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.

RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array

A circuit includes a first amplifier path configured to carry a first radio frequency signal, a second amplifier path configured to carry a second radio frequency signal, a first resonator connected to the first and second amplifier paths, the first resonator being configured to resonate at a radio frequency to isolate the first and second radio frequency signals from one another and further configured to pass signals at a baseband frequency, and a second resonator coupling the first resonator and a reference voltage node, the second resonator being configured to pass signals at the baseband frequency to the reference voltage node.

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Tempe, AZ, United States of America

Eric Johnson