International Business Machines Corporation

Eric James McKeever

Michael J Ellsworth, Jr

Amilcar R Arvelo

Levi A Campbell

Alan Frederic Benner

Edward Joseph Seminaro

Thong N Nguyen

Mark A Brandon

John G Torok

Richard P Snider

William Louis Brodsky

Randall G Kemink

Tan D Doan

Madhusudan K Iyengar

Robert E Simons

Richard C Chu

Milnes P David

Robert K Mullady

Francis R Krug, Jr

David P Graybill

Xiaojin Wei

Donald W Porter

Allan C VanDeventer

John Lee Colbert

Mark Garrison Clark

Wayne A Barringer

Robert G Atkins

Daniel A Wright

John Allan Shurdalsvold

A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Customized module lid

An apparatus includes a connector cover and a lever arm coupled to the connector cover, the lever arm being shaped to accommodate a portion of an activating pin, wherein contact of the activating pin with the lever arm causes a movement of the connector cover from a first position to a second position. The apparatus includes a latch assembly comprising a clamp, the clamp in a clamped position preventing the connector cover from moving from the first position to a second position. The apparatus includes a first bracket with a first indentation, the first indentation being sized to accommodate a portion of a first locating pin, wherein an insertion of the first locating pin into the first indentation moves the clamp from the clamped position to an unclamped position, the unclamped position permitting the connector cover to move when activated by the insertion of the activating pin.

Connector cover with separate activation and latching mechanisms

Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.

Coupling assemblies for connecting fluid-carrying components

Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.

Tapering couplers for connecting fluid flow components

Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Flexible coolant manifold&#x2014;heat sink assembly

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Compute intensive module packaging

Aspects of the present invention include an optical fiber connector for connecting optical fibers. The optical fiber connector includes a ferrule coupled to one or more optical fiber ribbons. The optical fiber connector includes a connector housing coupled with a radius controlled ribbon bending housing. The connector housing surrounds the ferrule on at least four sides, and the one or more optical fiber ribbons coupled to the ferrule are within the connector housing. The optical fiber connector includes a strain relief clamp coupled with the radius controlled ribbon bending housing.

Blind mating strain relieved optical fiber connector

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

Multi-component electronic module with integral coolant-cooling

Growing community of inventors

Poughkeepsie, NY, United States of America

Eric James McKeever