Qorvo US, Inc.

Eric Jackson

Dylan Murdock

Gregory Valenti

Ankush Mohan

Soack Dae Yoon

John Kitt

Power-combining devices, and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.

Structural arrangements for spatial power-combining devices

Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.

Heat exchanger assemblies for electronic devices

Spatial power-combining devices for higher frequency operation and increased bandwidth applications are disclosed. The spatial power-combining device includes a center waveguide section with a plurality of amplifier assemblies. The plurality of amplifier assemblies forms an input end and an output end, and an input inner conductor is mechanically attached to the input end, and an output inner conductor is mechanically attached to the output end. A method for joining a plurality of amplifier assemblies together to provide a center waveguide with an input end including an input connector receptacle and an output end including an output connector receptacle is also disclosed.

Spatial combining devices for high-frequency operation

A liquid heat transfer device with improved heat transfer into a heating or cooling fluid is disclosed. The heat transfer device incorporates an element which creates a helical flow path through a fluid conduit to more efficiently dissipate heat within a space-constrained environment without increasing the diameter or overall length of the fluid conduit.

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Moorpark, CA, United States of America

Eric Jackson