Intel Corporation

Eric J Zbinden

Marc Epitaux

Sylvain M Colin

Jean-Marc Verdiell

Jonas Webjorn

Robert Kohler

Tieyu Zheng

Tom Mader

Jan Peeters Weem

Tea H Nim

Iii Hall Thomas A

A transponder comprises a first TO having a first insulating base, a photodetector mounted on a first side of the first insulating base, and a metal cap hermetically sealed to the first side of the first insulating base to enclose the photodetector. The transponder also comprises a second TO can having a second insulating base, a light generation device mounted on a first side of the second insulating base, and a metal cap hermetically sealed to the first side of the second insulating base to enclose the light generation device. In one embodiment, the transponder operates at 10 GB/s.

Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

An optical device includes an apparatus for laterally shifting an optical beam. The optical device may be used in a focusing apparatus coupling an optical beam from a source waveguide to a receiving waveguide. The device may be an optical isolator that is mounted on supports that are slidably engaged with one another. The engagement may be at curved surfaces, to allow one support to rotate relative to the other. By rotating the optical isolator, a beam from the source waveguide and focused through the isolator may be selectively steered to couple it into the second waveguide. Such beam steering may be useful where the second waveguide has been misaligned from its optimum location. The beam steering may also be used to correct for post-weld displacement, where a lens of the focusing apparatus or other optical component has been misaligned during assembly. By using a rotating isolator, instead of the common multi-lens focusing apparatus, the coupling between source and receiving waveguides is far less susceptible to device alignment shifts.

Steering isolator for an opto-electronic assembly focusing apparatus

Two etalons in series may be angled to reduce parasitic reflections in the space between the two. The etalons may be soldered on either side of a post having an aperture there through to allow light to pass. Various sized solder balls and/or solder pads may be used to create the desired angle and to secure the etalons to the post. Alternatively, a lip on the post may create the desired angle. Once secured to the post, rather than aligning the etalons by pick and place methods individually, the post and attached etalons may be secured as a single unit to an optical system, such as within the cavity of an external cavity diode laser (ECDL).

Etalon positioning using solder balls

Alignment of optical components to one another in 3-degrees of freedom is facilitated by a U-clip and a sleeve having an off-axis optical component running there through. A generally U-shaped clip comprises a base a first arm and a second arm to form a channel. A generally cylindrical sleeve fits within the channel with a fiber or other optical component encased in the sleeve and positioned off center relative to a mechanical axis of the sleeve. Fine alignment adjustments may be made by sliding and rotating the sleeve within the channel.

U-clip for optical device alignment

A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

Optoelectronic assembly

Optoelectronic assembly having a flexure that supports multiple optical elements

An optical module package may include a body that, in one embodiment, may be made of metal. Ceramic inserts may be inserted into the metal body. The ceramic inserts may have a pair of shelves to facilitate electrical connection. In one embodiment, each shelf may include an upwardly directed contact surface and a downwardly directed contact surface. As a result, a more compact design may be formed in some embodiments which has desirable strength characteristics.

Optical module package

An opto-electronic module may be provided with an internal thermoelectric cooler. Components to be cooled may be positioned over the thermoelectric cooler. Other components may be positioned aside the cooled components but raised, using a riser, to position them away from the cooled components.

Cooling opto-electronic packages

In one embodiment, an optoelectronics package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other.

Growing community of inventors

Mountain View, CA, United States of America

Eric J Zbinden