Motorola Corporation

Eric J Woolsey

Douglas G Mitchell

Francis J Carney, Jr

George F Carney

Cary B Powell

A method of manufacturing electronic components includes disposing a top metal layer ( ) comprised of solder over a bottom metal layer ( ) comprised of titanium or tungsten, and selectively etching the bottom metal layer ( ) over the top metal layer ( ) with an etchant mixture ( ) comprised of an etchant, an additive to control the temperature of the etchant mixture ( ), and another additive to reduce the redeposition of the top layer ( ).

Method of manufacturing electronic components

An interconnect system (31) includes an interconnect bump (29) over an under bump metallurgy (25). The under bump metallurgy (25) includes a barrier layer (26) having a barrier material such as titanium, an adhesion layer (28) having an adhesion material such as copper, and a mixture layer (27) having both the barrier material and the adhesion material. The mixture layer (27) is located between the barrier layer (26) and the adhesion layer (28), and the adhesion layer (28) is located between the mixture layer (27) and the interconnect bump (29). The interconnect bump (29) contains solder and is used as an etch mask when patterning the under bump metallurgy (25).

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Chandler, AZ, United States of America

Eric J Woolsey