Intel Corporation

Eric J Moret

Srinivas V Pietambaram

Tarek A Ibrahim

John C Johnson

Paul J Diglio

Vineeth Abraham

Lawrence M Palanuk

Gregory A Stone

Srikant Nekkanty

Wesley Brook Morgan

Peter A Davison

Todd P Albertson

Phani Kumar Kandula

David N Lombard

Mark J Luckeroth

John Kelbert

Brad Bittel

Sufi Ahmed

Rodrigo De Oliveira Vivi

Robert W Edmondson

The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Method and device for fast, passive alignment in photonics assembly

Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

Methods and apparatus to reduce thermal fluctuations in semiconductor processors

The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

Method and system for attaching optical fibers to warped photonic chips

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Methods and devices for securing and transporting singulated die in high volume manufacturing

A mechanism is described for facilitating and employing a modular processing cell framework according to one embodiment. A method of embodiments may include accepting one or more semiconductor devices in one or more media at a modular processing cell framework ('framework') including a plurality of test cells, moving the one or more semiconductor devices from the one or more media to one or more test cells for testing; and testing the one or more semiconductor devices.

Mechanism for facilitating modular processing cell framework and application for asynchronous parallel singulated semiconductor device handling and testing

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Beaverton, OR, United States of America

Eric J Moret