Advanced Micro Devices Corporation

Eric J Chapman

Samuel D Naffziger

Stephen Victor Kosonocky

Vydhyanathan Kalyanasundharam

Alan Dodson Smith

Kaushik Mazumdar

Edward Chang

Eric M Scott

A multi-die processor semiconductor package includes a first base integrated circuit (IC) die configured to provide, based at least in part on an indication of a configuration of a first plurality of compute dies 3D stacked on top of the first base IC die, a unique power domain to each of the first plurality of compute dies. In some embodiments, the semiconductor package also includes a second base IC die including a second plurality of compute dies 3D stacked on top of the second base IC die and an interconnect communicably coupling the first base IC die to the second base IC die.

Multi-die stacked power delivery

A method for controlling a data processing system includes detecting a droop in a power supply voltage of a functional circuit of the data processing system greater than a programmable droop threshold. An operation of the data processing system is throttled according to a programmable step size, a programmable assertion time, and a programmable de-assertion time in response to detecting the droop.

Performance management during power supply voltage droop

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Austin, TX, United States of America

Eric J Chapman