Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Eric G Larson

Alan R Kirk

Ernest L Thurber

Gregg D Dahlke

Don H Kincaid

Robert J DeVoe

Walter L Harmer

David J Plaut

Roy Stubbs

Elizabeth C Edblom

Mark R Meierotto

Joel D Oxman

Brant Ulrick Kolb

Olester Benson, Jr

Wayne Scott Mahoney

Michael A Kropp

John Charles Clark

Wendy L Thompson

F Andrew Ubel

Peggy S Willett

Joel A Getschel

Timothy D Fletcher

Kohichiro Kawate

Jerry W Williams

Naota Sugiyama

Scott B Charles

Thomas E Boettcher

Jeremy M Higgins

Jon R Pieper

Ronald D Provow

Brett A Beiermann

Audrey S Forticaux

Jay R Lomeda

Hiroko Akiyama

Kyle R Schwartz

Scott R Culler

William J Schultz

Steven J Keipert

John J Gagliardi

Cheryl L Moore

Matthew J Kryger

Rufus C Sanders, Jr

Philip Miller

Robert A Follensbee

Cameron T Murray

Shijing Cheng

Scott J Buchanan

Glen Connell

Ravi K Sura

Brent D Niccum

Jeffrey W Nelson

William L Stoetzel

Walter W Pawlikowski, Jr

Robert L D Zenner

Thomas W Larkey

Yangbin Chen

Larry L Martin

Donald C Heinn

Jeff W Nelson

Blake R Dronen

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.

Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Semiconductor package resin composition and usage method thereof

A curable composition includes polyepoxide, high-melting metal particles having a melting point above 300&#xb0; C., low-melting metallic particles having a melting point of less than or equal to 300&#xb0; C., and a fluxing curing agent comprising a fluxing curing agent comprising: a hydroxyalkyl-substituted tertiary amine, and at least one diacid compound represented by the formula:HOC&#x2014;Z&#x2014;CHCHCH&#x2014;Z&#x2014;COHwherein Zand Zindependently represent a covalent bond or an aliphatic hydrocarbylene group. The at least one diacid compound comprises at least 50 percent of the total weight of carboxylic acids and anhydrides present in the curable composition. Articles comprising the curable composition, and methods of making the same are also disclosed.

Curable composition, articles comprising the curable composition, and method of making the same

Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.

Low temperature bonding electronic adhesives

Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Dicing and die attach adhesive

Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Dicing tape and die attach adhesive with patterned backing

Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and electrically conductive particles and/or scrim. Various embodiments add a silane coupling agent and/or an ethylenically unsaturated compound with acid functionality. Methods of using the compositions also are provided.

Anisotropic conductive adhesives

Provided are abrasive articles comprising a plurality of abrasive particles and a binder wherein the binder comprises a polymer formed by a reaction between a polyisocyanate and a polyoxirane, wherein the resulting binder is substantially free of urethane and urea linkages. Also provided is a method of making such an abrasive article.

Abrasive article and method

The present invention involves the use of powder coating methods to form coated abrasives. In one embodiment, the powder is in the form of a multiplicity of binder precursor particles comprising a radiation curable component. In other embodiments, the powder comprises at least one metal salt of a fatty acid and optionally an organic component that may be a thermoplastic macromolecule, a radiation curable component, and/or a thermally curable macromolecule. In either embodiment, the powder exists as a solid under the desired dry coating conditions, but is easily melted at relatively low temperatures and then solidified also at reasonably low processing temperatures. The principles of the present invention can be applied to form make coats, size coats, and/or supersize coats, as desired.

Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component

The present invention provides abrasive articles having projections attached to a major surface thereof, and methods of making such articles. The articles include (1) a reaction product of components that include (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom; and/or (2) a polymeric material preparable by combining at least (a) an epoxy-functional material, and (b) at least one of a cyclic anhydride or a diacid derived therefrom.

Abrasive article having projections attached to a major surface thereof

The present invention provides discrete particles and methods of preparing the discrete particles. The discrete particles include a plurality of abrasive grits and a polymeric material that includes a reaction product of components including (a) an epoxy-functional material, (b) at least one of a cyclic anhydride or a diacid derived therefrom, and optionally (c) a polyfunctional (meth)acrylate. The invention also provides articles made from the discrete particles and methods of making such articles. Preferably, the articles are abrasive articles.

Discrete particles that include a polymeric material and articles formed therefrom

Growing community of inventors

Lake Elmo, MN, United States of America

Eric G Larson