Quantum Bridge Communications, Inc.

Eric G Franklin

Darrel J Hamlet

An electronic chassis or modular rack has elements and methods for reducing emission of electromagnetic waves or interference (EMI) and at the same time ensuring that the components within the chassis or rack are properly cooled. A face plate which attaches to a printed circuit board or blank board for insertion and removal of the board from the chassis and limiting EMI emission while allowing connector and indicator accessibility. The face plate has an elongated frame having at least two planar body portions. The planar body portions are integrally formed to each other with the planes of the two planar body portions at an angle of between 25 and 55 degrees of each other. The elongated frame has a pair of free edges adjacent to the planar surfaces and the pair of side edges. The face plate has a pair of mounting devices. Each mounting device is carried by the elongated frame in proximity to one of the free edges. The pair of mounting devices are offset from each other about the planar body portions. The air impedance module or board inserts into the chassis for controlling air flow in the chassis. The top and bottom edges are adapted to be received in the chassis. An air impedance protrusion is formed integrally with the planar portion adapted for limiting the flow of air. The limiting of the flow of air in one portion results in the air being redirected to printed circuit boards that have active components that need cooling.

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Stoneham, MA, United States of America

Eric G Franklin