Intel Corporation

Eric Erike

Naoki Matsumura

Ralph V Miele

Juha Paavola

Olaotan Elenitoba-Johnson

Ulises Encarnacion

Sri Priyanka Tunuguntla

Shaun G Immeker

Methods, apparatus, systems, and articles of manufacture to increase stacking pressure in battery cells are disclosed. A disclosed battery includes an anode layer and a cathode layer stacked with the anode layer. The disclosed battery further includes a tension bearing structure to extend through at least one of the anode layer or the cathode layer.

Methods and apparatus to increase stacking pressure in battery cells

An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

Semiconductor chip package thermo-mechanical cooling assembly

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Mesa, AZ, United States of America

Eric Erike