Intel Corporation

Eric Dwight McAfee

Ralph V Miele

Andrew Larson

Mark Angus MacDonald

Mark E Sprenger

Barrett M Faneuf

Emery E Frey

Shankar Krishnan

Juan G Cevallos

Russell S Aoki

David Shia

Jeffory L Smalley

Sandeep Ahuja

Thomas A Boyd

Phil Geng

Casey R Winkel

Tod A Byquist

Glen Patrick Gordon

Eric W Buddrius

Michael Zack Eckblad

Kenan Huseyin Arik

Craig J Jahne

Joseph Andrew Broderick

Mustafa H Haswarey

Marc Milobinski

Rolf Laido

Aaron P Anderson

Evan A Chenelly

Brendan T Pavelek

Fernando Gonzalez Lenero

Carlos Alvizo Flores

Ming-Chen Chang

Minh T D Le

Divya Swamy Bandaru

Roger D Flynn

Jaime A Sanchez

Grant F Steen

Andy F Thompson

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Electronic systems with inverted circuit board with heat sink to chassis attachment

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions

Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.

System to reduce coolant use in an array of circuit boards

In an example, there is disclosed a smart sensor for monitoring a vehicle, including: a sensor array comprising a mechanical input sensor; a network interface; a processor; and one or more logic elements providing a data engine to: collect an vibration input from the mechanical input sensor; and report the data from the mechanical input sensor to a data aggregator via the network interface. There is also disclosed a data aggregation server engine to aggregate and correlate inputs from the smart sensor.

Crowdsourced failure mode prediction

Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.

Smart baseball first base or home plate

Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

Heat exchanger methods, apparatuses and systems with a manifold structure

Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Recirculating dielectric fluid cooling

A method and apparatus for holding a screw captive to a printed circuit board (PCB), with a channel formed through the apparatus and a mounting hole formed through the PCB being in alignment to allow a screw to pass therethrough.

Surface mount captive screw ferrule for PCB

A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.

High serviceability heatsink retainer method and apparatus

A computer assembly is described. That computer assembly includes a plate that contains a plurality of receptacles for receiving a plurality of fasteners, and that has a plurality of openings for enabling components to pass through it. The computer assembly also includes a plurality of fasteners, each being coupled to a receptacle, and a printed circuit board. The printed circuit board is attached to the plate by the plurality of fasteners, and a plurality of components pass through the openings formed in the plate.

Computer assembly with captivated screw carrier

Growing community of inventors

Portland, OR, United States of America

Eric Dwight McAfee