Delphi Technologies, Inc.

Other

Packard Hughes Interconnect Company

Eric Dean Jensen

William R Crumly

Haim Feigenbaum

Chris M Schreiber

Bao Le

Terry Shing Wang

Pete Henry Hudson

Michael Zahajko

Christopher M Schreiber

Blake F Woith

John Steven Szalay

Bao Q Le

Robert E Daugherty

Scott P Cohen

Robert Earl Daugherty, Jr

John De Nuto

Derek Zahajko

Robert Joseph Cochrane

Kimball Garvin

A composition for removing spillage on asphalt paving of hydrocarbon substances which includes modifiers, chemical oxidizers and bacteria which metabolizes both the spillage and a softened top layer of asphalt paving to aid in rehardening the surface of the mat while not metabolizing the underlying asphalt paving unaffected by the spillage.

Asphalt surface cleaning composition with bitumen rehardening and method

A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint. The at least one sensor sends a signal to the microprocessor regarding the energy intensity level, from which the microprocessor creates a fingerprint image as the energy emitting pixels are sequentially illuminated.

Fingerprint reader

A fingerprint reader includes a display screen composed of an array of energy emitting pixels covered by a transparent cover, at least one sensor coupled along an edge of the display screen, a display driver directing the array of energy emitting pixels of the display screen to illuminate in a predetermined sequence, and a microprocessor in communication with the display driver and the at least one sensor. The microprocessor knows the location of the energy emitting pixel being illuminated and the specific time at which the illumination occurs. In use, and when at least one finger is placed on the transparent cover and the display driver is activated, energy from each energy emitting pixel sequentially illuminated is reflected off the fingerprint to the at least one sensor. The energy received at the at least one sensor is at different intensity levels depending upon the ridges and valleys of the at least one fingerprint. The at least one sensor sends a signal to the microprocessor regarding the energy intensity level, from which the microprocessor creates a fingerprint image as the energy emit emitting pixels are sequentially illuminated.

A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

Stress relief bend useful in an integrated circuit redistribution patch

A shim is provided which can be used in a connector system, whereby a flexible connector having contact surfaces is compressed against an electronic circuit board by a resilient material. The shim is incorporated between the resilient material and the flexible connector contact surfaces so as to uniformly transfer the load from the resilient material to the contact surfaces. Moreover, the shim prevents the resilient material from taking a set and the flexible connector from draping when operating under hot and/or high load conditions.

Bump contact force concentration system and method

A modular, snap-together clamping system for electrically interconnecting two printed circuit boards using a flexible circuit is provided. The clamping system comprises two inboard clamp members which are configured to cooperate with two generally complimentary outboard clamp members, so as to capture a portion of each of the printed circuit boards along with two end portions of the flexible circuit between the inboard clamp members and the outboard clamp members in a manner which facilitates electrical connection of each of the two printed circuit boards with the flexible circuit. The inboard clamp members are also configured to facilitate attachment of an interchangeable spacer thereto. The spacer is configured to facilitate desired positioning of the two printed circuit boards with respect to one another.

Connecting system for printed circuit boards

A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Z-axis electrical interconnect

A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.

Chip scale package

The present invention includes stack flexible circuit layers having raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. An intermediate or adhesive layer separates each circuit layer. The multiple layers are stacked with the raised features from one layer aligning with pads of an overlying or underlying layer and are laminated so that the raised features pierce the intermediate or adhesive layer and make electrical contact with the corresponding pad of the adjacent circuit layer. The raised features may have a shape sufficient to penetrate the intermediate and/or the adhesive layer allowing blind vias to be made without pre-drilling the intermediate or adhesive layers. The intermediate layer of film can have a function other than or in addition to that of an adhesive. For example, in a connector application where the raised feature is used to make contact to corresponding pads, a film that has a low permeability to water could be placed between the raised features and corresponding pads on the next layer. The low water permeability film would act as a sealant to prevent environmental attack on the connection. The raised feature would penetrate the sealant to make electrical contact to a corresponding pad. This would allow the connector to be disassembled and reconnected.

Layer to layer interconnect

Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.

Integrated circuit with a chip on dot and a heat sink

A variable rate pressure sensitive electrical device or switch. The switch includes a first substrate and a plurality of electrical circuit traces thereon. A first electrical trace is provided having a first set of raised contact features or bumps projecting from a prevalent planar portion of first electrical trace. At least a second electrical trace is provided having a second set of raised contact features or bumps extending above a planar portion of second electrical trace. The first and second electrical traces and associated raised contact features are constructed and arranged so that the height of the first set of raised contact features is greater than the height of the second set of raised contact features. A second substrate is provided with an electrically conductive element. At least one of the first and second substrates is deflectable and at least one of the first and second substrates is moveable with respect to the other so that the second substrate can make contact with the first set of raised contact features in a first position, and in a second position the second substrate can make contact with both sets of raised features to provide an electrical path across the first and second electrical traces.

Switch having raised contact features and a deflectable substrate

A fire igniting device which includes a rod of an ignitable material, particularly magnesium, and has a pyrophoric element adhered to the rod along its length. A head is secured to the rod, and also may be fitted to a case, so that a spent rod can be removed and discarded from a handle, and another rod installed. The case is adapted to receive the rod during periods of non-use, to protect it from contaminants; and, during use, the case may be fitted to the other end of the head so as to increase the effective length of the head and provide a more comfortable grip to the user. A metal striker for striking the pyrophoric element is conveniently tethered to the case. Magnesium shavings are scraped from the rod, and are then ignited by striking the pyrophoric element with the striker. The fire igniting device may be incorporated into the handle of a survival knife, whereby the handle functions as a case for the magnesium rod during periods of non-use.

Growing community of inventors

Irvine, CA, United States of America

Eric Dean Jensen