Other

Santa Barbara Research Center

Eric D Olson

Paul Olson

Donald W Olson

Eric Frank Schulte

Robert D Funk

A counter-pressure filler system includes a vertically-translatable platform capable of supporting a container, a pressurizable chamber having an entrance aperture, the chamber enclosing a seaming chuck and at least one seaming roller, a vertically-translatable enclosure comprising an upper portion configured to engage a portion of said chamber around the entrance aperture, thereby creating a pressurizable atmosphere within said vertically-translatable enclosure and the pressurizable chamber. The seaming chuck is configured to allow a beverage ingredient to pass therethrough and into said container.

Counter-pressure filler

A method for forming a food package product is disclosed. The food package product includes layers and patches of adhesive strategically placed on packaging stock that prevents leakage of liquid products. In an exemplary embodiment, the food package product is microwavable popcorn.

Leak-resistant food package products and methods therefor

A food packaging system includes, in a serially coupled, operational configuration: a) an automated bag forming system; b) a bag rotator; c) a blade wheel; d) a bag top opener assembly; e) a funnel positioning system; f) a hopper system; g) an oil injection system; h) a sealing station; i) a crimping assembly; and j) an offloading assembly. A carriage conveyor system is configured to receive a bag formed by the automated bag forming system and convey the bag sequentially from component b) to component j).

Systems and methods for automated food packaging

A method is disclosed for joining two semiconductor devices 10 and 10', each having a plurality of metallic contact bumps 12 and 12' on the major surfaces 14 and 14' thereof. The devices are etched to remove oxide 18 from the contact bumps and to prevent subsequent oxidation thereon. The devices are then oriented so that the bumps 12 and 12' on the respective devices are aligned opposite each other. By applying pressure to the devices, the bumps are caused to cold-weld together to form a single device 24.

Growing community of inventors

Mora, MN, United States of America

Eric D Olson