Intel Corporation

Eric D Mcafee

Barrett M Faneuf

Jeffory L Smalley

David Shia

Ralph V Miele

Sandeep Ahuja

Phil Geng

Casey R Winkel

Mark J Gallina

Kenan Huseyin Arik

Brian S Jarrett

Marc Milobinski

Aaron P Anderson

Carlos Alvizo Flores

Jason B Chesser

Fernando Gonzalez Lenero

Brendan T Pavelek

Mike G Macgregor

Minh T D Le

Thu Huynh

Mark J Luckeroth

Michelle Goeppinger

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Expansion card having synergistic cooling, structural and volume reduction solutions

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Portland, OR, United States of America

Eric D Mcafee