International Business Machines Corporation

Eric D Marz

Kirk David Peterson

William James Anderl

Todd Jon Rosedahl

Howard V Mahaney, Jr

Eric Jason Fluhr

Nicolas E Pizzuti

Jared P Yanofsky

Christine Whiteside

Tassbieh Hassan

Matthew G Bausch

Nathaniel Rex

Benjamin J Pierce

Greg Abrami

Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.

Predetermining separate thermal control points for chips of a multi-chip module

Embodiments of the invention are directed to a method and resulting structures for identifying an integrated circuit (IC) chip using optically-unique features. In a non-limiting embodiment of the invention, an imaging device generates an image of the chip. One or more optical features of the chip within the image can be determined and stored in a local or remote database. Metadata associated with the chip can be generated and linked with the one or more optical features of the chip and a unique identifier of the chip in the database.

Passive methods of loose die identification

Various embodiments include localized hardening of dicing channels in an integrated circuit (IC) wafer. In some embodiments, a method includes: applying localized heat to a metal interconnect in a wafer kerf on an IC wafer using a heat source; and removing the heat source to cool the metal interconnect after the applying of the localized heat to the metal interconnect, wherein the applying of the heat and the removing of the heat source increases a hardness of the metal interconnect.

Methods of localized hardening of dicing channel by applying localized heat in wafer kerf

Growing community of inventors

Winooski, VT, United States of America

Eric D Marz