Hughes Electronics Corporation

Eric D Ditmars

Hector J De Los Santos

Yu-Hua Kao Lin

Andrew H Kwon

John R Dunwoody

Arturo L Caigoy

Yu-Hua Kao

A microwave microstrip/waveguide transition structure includes a substrate, an elongated microstrip layer residing on a surface of the substrate, and an elongated integral hollow waveguide on the surface of the substrate. The microstrip layer and a side of the hollow waveguide constitute a single continuous piece of metal. The transition structure is fabricated by providing a substrate, depositing a metallic layer on the substrate, and depositing a metallic hollow housing continuous with a portion of a length of the metallic layer. The metallic hollow waveguide bounded by the metallic layer and the metallic hollow housing and having a contained volume therewithin is thereby defined.

Method of fabricating a microwave microstrip/waveguide transition structure

A microelectromechanical (MEM) device includes a substrate and a flexible cantilever beam. The substrate has positioned thereon a first interconnection line separated by a first gap and a second interconnection line separated by a second gap parallel to the first interconnection line. The substrate also has positioned thereon a first and second primary control electrode wherein one of the first and second primary control electrodes is positioned on one side of one of the first and second interconnection lines and the other one is positioned on the other side of the other first and second interconnection lines. The flexible cantilever beam has a top surface and a bottom surface and a beam width slightly larger than the gap widths at the gaps. A flexible anchor is secured to the bottom surface of the beam at a center of the beam and attached to a center of the substrate so as to position the beam orthogonally to the first and second interconnection lines. Secondary control electrodes are secured to the bottom surface of the beam and positioned opposite the primary control electrodes. First and second contact pads are secured to the bottom surface of the beam and positioned opposite the first and second interconnection lines.

Microelectromechanical device

Growing community of inventors

Redondo Beach, CA, United States of America

Eric D Ditmars