Koninklijke Philips Corporation N.v.

Nxp B.v.

Philips Lighting Holding B.v.

Signify Holding B.v.

Lumileds LLC

Tessera Advanced Technologies, Inc.

Philips Gmbh

Eric Cornelis Egbertus Van Grunsven

Marc Andre De Samber

Freddy Roozeboom

Egbertus Reinier Jacobs

Esther Anna Wilhelmina Gerarda Janssen

Roy Antoin Bastiaan Engelen

Ronald Dekker

Johan Hendrik Klootwijk

Aldegonda Lucia Weijers

Jan De Graaf

Frank Verbakel

Klaus Jürgen Engel

Martinus Arnoldus Cornelis Heijmans

Marc André De Samber

Franciscus Hubertus Marie Sanders

Maria Mathea Antonetta Burghoorn

Antonius L A M Kemmeren

Roger Steadman Booker

Herfried Karl Wieczorek

Ira Micah Blevis

Antonius Johannes Maria Nellissen

The invention provides an LED filament device () comprising (i) a first LED filament side (), (ii) a second LED filament side (), (iii) an intermediate layer (), and (iv) a plurality of sources of light (), wherein: (a) first sources of light () are configured to generate first white light () having a first correlated color temperature CCT; wherein the first sources of light () are associated to the first filament side (); (b) second sources of light () are configured to generate second white light () having a second correlated color temperature CCT; wherein the second sources of light () are associated to the first filament side (); wherein CCT−CCT≥500 K; (c) third sources of light () are configured to generate blue third light (); wherein the third sources of light () are associated to the second filament side (); (d) fourth sources of light () are configured to generate green fourth light (); wherein the fourth sources of light () are associated to the second filament side (); (c) fifth sources of light () are configured to generate red fifth light (); wherein the fifth sources of light () are associated to the second filament side (); () the intermediate layer () comprises a thermally conductive element (); and (g) the first LED filament side (), the second LED filament side (), and (iii) the intermediate layer () are comprised by a sandwich arrangement (), wherein the intermediate layer () is configured between at least part of the first LED filament side () and at least part of the second LED filament side ().

Optical and thermal improvement of a two-sided multi-channel filament

The invention provides a water-activatable luminescent particulate material () comprising particles (), wherein each particle () comprises a solid state light source () functionally coupled with a water-activatable battery () and a water absorbing shell () enclosing at least part of the water-activatable battery (). The invention also provides a luminescent particulate material spray device comprising a container configured to host the water-activatable luminescent particulate material.

Particulate water-activatable luminescent materials

In a wafer bonding process, one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate, the wafer's characteristics during bonding are similar to that of a thinner wafer, thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably, the slots are created consistent with the singulation/dicing pattern, so that the slots will not be present in the singulated packages, thereby retaining the structural characteristics of the full-thickness substrates.

Low warpage wafer bonding through use of slotted substrates

A liquid immersion transfer process for applying electronics on a 3D object and a system is disclosed. In one embodiment, the process comprises providing a foil on a solid carrier in a foil provision stage, providing electronic wiring and an electronic component to the foil in an electronics provision stage, to provide said electronics, removing the solid carrier and arranging the foil on or in a liquid in a liquid application stage, and transferring the electronics to the 3D object in a transfer stage, as well as a 3D object obtainable by such process.

Liquid immersion transfer of electronics

A semiconductor device and a method for manufacturing such semiconductor device for use in a stacked configuration of the semiconductor device are disclosed. The semiconductor device includes a substrate including at least part of an electronic circuit provided at a first side thereof. The substrate includes a passivation layer and a substrate via that extends from the first side to a via depth such that it is reconfigurable into a through-substrate. The semiconductor device further includes a patterned masking layer on the first side of the substrate. The patterned masking layer includes a trench extending fully through the patterned masking layer. The trench has been filled with a redistribution conductor. The substrate via and the redistribution conductor include metal paste and together form one piece, such that there is no physical interface between the through-substrate via and the redistribution conductor. Thus, the parasitic resistance of this electrical connection is reduced.

Through-substrate via and redistribution layer with metal paste

The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer. This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material. According to the second aspect of the invention, opening the covered trench from the second substrate side and allowing the cap-layer material to be removed through that opening provides a solution. Both methods of the present invention are based on the common idea of using a temporary cap-layer even in a situation where the substrate opening is permanently covered before the removal of the temporary cap-layer.

Producing a covered through substrate via using a temporary cap layer

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Someren, Netherlands

Eric Cornelis Egbertus Van Grunsven