Stmicroelectronics (research & Development) Limited

Stmicroelectronics Gmbh

Stmicroelectronics R&d Limited

Stmicroelectronics S.r.l.

Stmicroelectronics (rousset) Sas

Eric Christison

Wing Shenq Wong

Andy Price

Pierangelo Magni

Kevin Channon

Andrea Giovanni Cigada

Brendan Dunne

Robert Nicol

Francesco Sala

Iain McAllister

A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

Molded range and proximity sensor with optical resin lens

A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material.

Camera modules

A lens barrel is mated with a lens mount through use of a screw thread whereby relative rotation adjusts lens focus. The lens barrel and lens mount are additionally provided with an interengaging formation that is interposed between an optical axis of the lens barrel and the screw thread. This formation provides a cylindrical sliding contact which isolates any particles produced by operation of the screw thread from reaching the optical components at or near the optical axis.

Adjustable lens mounting assembly

A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

Method of manufacturing an image sensing micromodule

A lens assembly for an imaging device includes a lens for focusing external radiation towards an image sensor of the imaging device. A mounting member is between the lens and the image sensor so that the lens is spaced a set distance from the image sensor. An adjustment member varies position of the mounting member relative to the image sensor so that the set distance is varied.

Lens assembly with a rotatable adjustable member for discretely varying position of a mounting member

An image-detecting device including: a body housing a sensor; a first supporting element, rigidly coupled with the body and defining a seat; and an objective including at least one optical unit having an optical axis. The seat forms a guide portion engaging directly and slidably an alignment portion formed by said optical unit to keep the optical axis orthogonal to the sensor.

Growing community of inventors

Edinburgh, United Kingdom

Eric Christison