Apple Inc.

Globalfoundries Inc.

Eric Chiu

Zachary Z Becker

Tyler L Casella

Michelle Chua

David Adam Lipton

Sriram Madhavan

Eric Gregory Thivierge

Ryan S Burgoyne

Karen Natalie Wong

Uwe Paul Schroeder

Shobhit Malik

Thomas Herrmann

Mahdi Nabiyouni

Shikha Somani

Stefan Schüler

A three-dimensional preview of content can be generated and presented at an electronic device in a three-dimensional environment. The three-dimensional preview of content can be presented concurrently with a two-dimensional representation of the content in a content generation environment presented in the three-dimensional environment. While the three-dimensional preview of content is presented in the three-dimensional environment, one or more affordances can be provided for interacting with the one or more computer-generated virtual objects of the three-dimensional preview. The one or more affordances may be displayed with the three-dimensional preview of content in the three-dimensional environment. The three-dimensional preview of content may be presented on a three-dimensional tray and the one or more affordances may be presented in a control bar or other grouping of controls outside the perimeter of the tray and/or along the perimeter of the tray.

Devices, methods and graphical user interfaces for three-dimensional preview of objects

A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Feed-forward for silicon inspections (DFM2CFM : design to silicon) and feed-back for weakpoint predictor decks (CFM2DFM : silicon to design) guided by marker classification, sampling, and higher dimensional analysis

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San Jose, CA, United States of America

Eric Chiu