Stmicroelectronics S.a.

Stmicroelectronics R&d Limited

Eric Chistison

Kevin Channon

Rémi Brechignac

Jean-Luc Diot

A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.

Growing community of inventors

Edinburgh, United Kingdom

Eric Chistison