Kawasaki Jukogyo Kabushiki Kaisha

Kawasaki Robotics (usa), Inc.

Lam Research Corporation

Eric Chan

Ming Zeng

Richard M Blank

Hajime Nakahara

Hirohiko Goto

Avish Ashok Bharwani

Shigeki Ono

Takeshi Shibata

Takao Yamaguchi

Yukimasa Yamada

Mark Tang

Arulselvam Simon Jeyapalan

Shinya Kitano

Tomokazu Arita

Marco Piccigallo

Francisco J Duran, Jr

Disclosed are techniques and systems for automatically determining and correcting the levelness of a wafer handling robot end effector. The systems may use a tilt sensor or a gravitational field sensor which may be calibrated to the wafer handling robot. The output from the tilt sensor may be used to determine or estimate the tilt of an end effector of the wafer handling robot and to perform correctional positioning to reduce or eliminate the tilt, to automatically teach certain positions that have reduced tilt, to perform health checks on the robot, provide feedback to a user, etc.

Wafer handling robot with gravitational field sensor

A method of teaching a robot, the robot including a first and second end effector that are mounted to a robotic arm wrist, the first and second end effector being rotatable about a same rotational axis independently of each other. The method includes: a first step of, in a state where rotational positions of the first and second end effectors about the rotational axis coincide with each other, attaching a relative motion preventing device to the first and second end effector, the relative motion preventing device preventing the first and second end effector from moving relative to each other; and a fourth step of generating a teaching point of the second end effector based on: a teaching point of the first end effector; and rotational position information about the first and second end effector that are stored in a storage unit in association with each other in a third step.

Method of teaching robot

A control unit of a substrate conveying robot makes a robot arm and a substrate holding device execute a blade member advancing operation, a substrate receiving operation, and a substrate placing operation. The substrate holding device is configured to be capable of being switched between a first working state that a pair of blade members are arranged in the vertical direction and a second working state that a pair of blade members are arranged in a position out of the vertical direction and a single blade member can be advanced into a substrate placing structure.

Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction

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San Francisco, CA, United States of America

Eric Chan