Mbda France

Eric Cadalen

Mikaël Saturnin

The connection method between at least two elements (E, E) corresponding to a printed circuit () and to an electronic component (), comprises a step of forming a plurality of pad-type stacks () of bosses (), the stacks () of bosses () being formed on a face () of a first (E) of the elements (E, E), the stacks () of bosses () each comprising the same given number of bosses (), said method also comprising a step of depositing a brazing product () on this first element (E) provided with stacks () of bosses (), a step of arranging the second (E) of the elements (E, E) on the first element (E), and a step of remelting the assembly thus formed, in order to obtain an electronic device (). This method makes it possible to produce a precise and flexible raising of surface mounted electronic components.

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Le Plessis-Robinson, France

Eric Cadalen