Intevac, Inc.

Eric C Lawson

Terry Bluck

John L Hughes

Kevin P Fairbairn

Samuel Dacke Harkness, Iv

Patrick Leahey

Charles Liu

Robert L Ruck

George L Coad

James H Rogers

Tatsuru Tanaka

Jun Xie

Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.

System architecture for combined static and pass-by processing

A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system configuration. A dual processing module, including first and second process stations, is selectably operable in a serial mode or a parallel mode.

Substrate processing system

A disk gripper for gripping an insulating disk, such as a glass disk, at its edge during processing includes a contact device for contacting the edge of the insulating disk and a mechanism for moving the contact device between a contact position, in contact with the edge of the disk, and a retracted position. In a first processing station, a conductive coating is applied to a disk held by the gripper, with the contact device in the retracted position. In a second processing station, ions are generated in a plasma adjacent to the surface of the disk held by the gripper. The contact device is in the contact position in contact with the conductive coating, and a bias voltage is applied to the contact device in the second processing station. The ions are accelerated from the plasma toward the disk by the bias voltage applied to the conductive coating.

Methods and apparatus for processing insulating substrates

A vacuum processing system for handling and processing rectangular glass panels for flat panel displays has a cluster configuration. The system includes a central buffer chamber, with multiple processing chambers, a load lock and an unload lock positioned around the buffer chamber and coupled to the buffer chamber through gate valves. The buffer chamber contains a turntable that is rotatable about a vertical axis. The system further includes substrate carriers, each for supporting a substrate in a vertical orientation as it is transported through the system and is processed. The turntable has dual substrate carrier positions for rotating substrate carriers into alignment with a selected processing chamber, the load lock or the unload lock. Multiple substrates can be handled and processed concurrently to achieve a high throughput rate. The system is typically used for sputter deposition of ITO films and metal films on the glass substrate.

Substrate handling and processing system for flat panel displays

This invention relates to a system for handling and processing thin substrates, such as substrates for magnetic disks. The system includes a main chamber, entrance and output load locks, a buffer chamber, substrate load/unload structure, and a plurality of substrate processing stations positioned contiguous with the main vacuum chamber. The system further includes a transport for moving a plurality of cassettes carrying vertically oriented substrates into the entrance load lock, to the buffer chamber where the substrates are transferred into the main chamber, and to the output load lock where processed substrates are placed back in the cassettes. The substrates are transferred to and from the cassettes to and from the substrate load/unload structure by way of dedicated lift blades. The system further employs a simple three-step transfer of the substrates from processing station to processing station which greatly increases the throughput potential compared to prior art systems which rely on complex substrate handling and transfer.

Substrate handling and processing system

A system for handling and processing thin substrates, such as substrates for magnetic disks. The system includes a main chamber, entrance and output load locks, a buffer chamber, substrate load/unload mechanism, and a plurality of substrate processing stations positioned contiguous with the main vacuum chamber. The system further includes a transport for moving a plurality of cassettes carrying vertically oriented substrates into the entrance load lock, to the buffer chamber where the substrates are transferred into the main chamber, and to the output load lock where processed substrates are placed back in the cassettes. The substrates are transferred to and from the cassettes to and from the substrate load/unload mechanism by means of dedicated lift blades. The system further employs a simple three-step transfer of the substrates from processing station to processing station which greatly increases the throughput potential compared to prior art systems which rely on complex substrate handling and transfer.

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Sunnyvale, CA, United States of America

Eric C Lawson