Illinois Tool Works Inc.

Speedline Technologies, Inc.

Eric Becker

John Neiderman

Michael Brainard

Scotty Slavens

James Morris

David M McDonald

Keith Howell

Joseph Wayne Brickell

Dirk Ellis

Kenneth Kirby

A cleaning apparatus is configured to clean electronic substrates including printed circuit boards and semiconductor product assemblies. The cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a spray system having a manifold connected to a source of fluid and a plurality of spray bars fluidly coupled to the manifold, and an adjustable height spray system configured to move the manifold and the plurality of spray bars up and down with respect to the conveyor system.

Adjustable height spray system for cleaner

An apparatus configured to join electronic components to an electronic substrate includes a chamber housing including a tunnel extending through multiple processing zones, a conveyor configured to transport electronic substrates in the tunnel through the multiple processing zones, and a heat detection system including at least one temperature sensor coupled to the chamber housing. The at least one temperature sensor is configured to detect temperatures of the electronic substrates passing proximate to the at least one temperature sensor. The apparatus further includes a controller coupled to the multiple processing zones, the conveyor and the heat detection system. The controller is configured to receive temperature data from the heat detection system.

Apparatus having closed loop IR camera heat detection system and method

A cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a source of fluid. The manifold includes at least one outlet. The at least one cleaning module further includes an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles and a pressure sensor coupled to the automatic valve. The pressure sensor is configured to measure pressure of fluid flowing through the conduit. The automatic valve is configured to adjust the flow of fluid through the conduit based on the pressure measured by the pressure sensor.

Automated pressure control system and method for a cleaner

A conveyor system is configured to transport the electronic substrates through the cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member spaced from the first outer frame member, a bottom belt disposed between the first outer frame member and the second outer frame member, and a top belt spaced from the bottom belt. The bottom belt and the top belt are configured to receive a product carrier therebetween to transport electronic substrates along the conveyor system and through the cleaning modules. The conveyor system further includes a plurality of roller assemblies, with at least one roller assembly being coupled to the first outer frame member and at least one roller assembly being coupled to the second outer frame member. Each roller assembly is configured to apply a force on the top belt or the bottom belt.

Hold down tray conveyor

A conveyor system is configured to transport the electronic substrates through cleaning modules of a cleaning apparatus. The conveyor system includes a first outer frame member, a second outer frame member, a bottom belt assembly disposed between the first outer frame member and the second outer frame member, and a top belt assembly spaced from the bottom belt assembly. The bottom belt assembly and the top belt assembly are configured to an electronic substrate therebetween to transport the electronic substrate along the conveyor system and through the at least one cleaning module. The bottom belt assembly or the top belt assembly includes a mesh material belt fabricated from heat resistant synthetic fibers. The conveyor system further includes a plurality of pins secured to the bottom belt assembly or the top belt assembly to create at least one lane along a length of the conveyor system.

Laned belt for cleaner

A method and apparatus for cleaning printed circuit boards are provided. The method includes providing a cleaning apparatus with a housing having a conveyance mechanism for carrying printed circuit boards through the housing. The cleaning apparatus has at least a prewash station, a wash station and a final rinse station therein. The printed circuit boards are carried on the conveyance mechanism to the prewash station. A plurality of fluidic oscillator nozzles of the prewash station are utilized to direct liquid onto the printed circuit boards. Each fluidic oscillator nozzle outputs a stream of liquid with an instantaneous direction that oscillates back and forth relative to a nozzle axis over time.

Liquid cleaning apparatus for cleaning printed circuit boards

When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing the dross from the reservoir includes a skimming plate pivotally attached to a displaceable structure; a stop is provided to restrict the degree to which the skimming plate can pivot so that the skimming plate will not pivot more than 90&#xb0; from vertical to enable the skimming plate to dig into the dross and collect dross when the displaceable structure is displaced toward on outlet of the reservoir. Further still, the displaceable structure of the skimmer can be controlled via a computer control system storing software code instructions for a motor to extend and retract the displaceable structure such that the skimming plate extends to a position further from the outlet port of the reservoir with each displacement cycle.

Dross removal and solder reclamation improvements

Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled.

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Lebanon, MO, United States of America

Eric Becker