Applied Materials, Inc.

Other

Adept Technology, Inc.

Eric Anton Nering

Ilya Perlov

Eugene Gantvarg

Victor Belitsky

Robert L Otwell

Bryan Von Lossberg

Dan R Fleming

The processing status of a plurality of semiconductor wafers undergoing processing is positively identified by the use of indicator flags associated with cassettes containing the wafers. The flags are moved between at least two processing state indicating positions during processing of the wafers by a robotic arm that also transfers the wafers between the cassettes and a wafer processing station.

Methods and apparatus for positive wafer process status identification during semiconductor wafer processing

The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Wafer positioning device with storage capability

A thermal processing chamber configured to enclose and heat treat a single electronic substrate at an exposed surface, such as a wafer or electronic circuit board being re-melted, includes an enclosed gas tight and particle free heat insulated chamber. An electronic substrate support is placed within the enclosed gas tight and particle free heat insulated chamber. A convection gas inlet distribution manifold adjustable in spatial relation towards and away from the surface to be treated provides a flow of heated gas over and onto the exposed surface of the electronic substrate to be treated. A heated convection gas outlet is placed below the electronic substrate for the collection of heated gas after flowing over, around and below the exposed surface of the electronic substrate to be treated. A door is movable between and open and closed position. The door opens a path to move the electronic substrate into and out of the chamber to and from the electronic substrate support in an open position. The door has a gas-tight seal with respect to the chamber when in the closed position. A heater having an inlet for receiving gas, and an outlet for discharging heated gas provides heated gas for the convection treatment. A heat exchanger receives gas from the convention gas outlet and discharges gas to the heater inlet to enable heat recovery from the gas discharged from the convention gas outlet and to simultaneously enable precise temperature control. Provision is made for disposing individual ovens in juxtaposition to enable multiple substrates to be processed simultaneously.

Single-wafer process chamber thermal convection processes

An interface for transferring wafer carriers between a conveyor and a process chamber load location is provided. The interface has two portions. The first portion is configured so that a first wafer carrier moving along a wafer carrier transport mechanism (e.g., a conveyor) may travel therethrough. The second portion is configured so that a second wafer contained within the second portion may index between a first position and a second position without obstructing passage of the first wafer carrier through the first portion. The interface contains an indexer/elevator that facilitates wafer carrier coupling and uncoupling from the conveyor, and facilitates wafer transfer to and from wafer handlers that load process chambers. Numerous interfaces can be employed to create semiconductor device fabrication systems and to interconnect various semiconductor device fabrication systems.

Apparatus and method for automated cassette handling

A vacuum processing system has a wafer handling chamber, such as a mini-environment, for moving wafers therethrough. The wafer handling chamber has a wafer aligner, or orienter, for aligning the wafers according to the requirements of a process that the wafer is to undergo in the system. The wafer aligner is disposed at a location in the wafer handling chamber to minimize the number of movements that the wafer makes as it passes through the wafer handling chamber, to minimize interference between wafer handlers, or robots, when more than one wafer handler is used in the wafer handling chamber and to minimize the footprint area of the system. The presence of the wafer aligner in the wafer handling chamber eliminates the need to provide a separate wafer aligning chamber in the system.

Wafer aligner in center of front end frame of vacuum system

A pod loading station and method of operation are provided for enabling the transfer and introduction of wafers into a processing system from a wafer pod. The pod loading station generally includes a movable receiving platform for supporting a wafer pod and a movable pod door receiver having a pod door latch actuating mechanism disposed thereon. The movable platform supports a wafer pod, moves the wafer pod into engagement with the pod door receiver, and then retracts to enable the door supported by the door receiver to be removed from the opening of the pod. The pod door receiver then lowers the pod door below the pod to enable access to the pod opening.

Wafer cassette load station

A turbo-axial fan assembly is provided for a clean-air supply system of a substrate handling module of a vacuum processing system. The turbo-axial fan assembly has one or more turbo-axial fans for generating airflow through the substrate handling environment. The turbo-axial fans have tunable vanes for controlling the speed of the airflow and efficiently using the available power.

Vacuum processing system with turbo-axial fan in clean-air supply system

A coordinated cluster-tool energy distribution system provides a systems level approach to supplying all process energy needs for such industrial applications as those found in the semiconductor manufacturing industry, e.g. a single-wafer or multiple chamber processing chamber. The system is preferably provided as an integrated whole, rather than as a piece-meal collection of various energy distribution elements. The system comprises a shared DC bus that provides load diversity at lower energy levels, eliminates power supply components and/or minimizes the operating capacity of such components, and provides a lower installed cost; a common rectifier/filter or switcher power supply front end that lowers overall system cost, eliminates redundant power supply components, and provides a smaller system form factor; and (optionally) an energy storage device, such as a battery, capacitor, or flywheel, that reduces peak demand, thereby allowing smaller feeder circuits and a smaller energy source, and further providing ride through protection against brown-outs.

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Modesto, CA, United States of America

Eric Anton Nering