United Solar Systems Corporation

Sky Solar L.l.c.

Eric Akkashian

Troy Glatfelter

Mark Lycette

Kevin Beernink

A photovoltaic module includes at least a first and a second photovoltaic cell each having a substrate electrode, a top electrode and a photovoltaic semiconductor body disposed therebetween in electrical communication with the substrate electrode and the top electrode. Each cell includes a plurality of current collecting grid wires disposed atop the top electrode in electrical contact therewith. The grid wires of the first cell are in electrical communication with a current collecting bus bar and the grid wires of the second cell extend onto the first cell so as to establish an unbroken current path therebetween. The grid wires of the second cell may establish electrical communication with the substrate electrode of the first cell, in which case a series connection therebetween is established. Alternatively, the grid wires of the second cell may establish electrical communication with the top electrode of the first cell so as to create a parallel electrical connection therebetween. Also disclosed are methods for manufacturing the modules.

Series connected photovoltaic module and method for its manufacture

Lightweight semiconductor devices are fabricated upon a relatively thin substrate member by a process wherein the substrate is first bonded to a relatively thick support member. The semiconductor device is then formed on the bonded substrate, and the substrate is subsequently removed from the support member by utilizing a beam of radiant energy to skive the substrate from the support member without damage to the semiconductor device. Also disclosed herein is a system for implementing the invention.

Method and apparatus for the fabrication of lightweight semiconductor

A large area photovoltaic device includes a plurality of photovoltaic regions electrically interconnected in parallel. The regions are defined by a plurality of conductive channels which establish electrical contact between a top transparent electrode of the device and a monolithic, metal substrate electrode. A second terminal of the device is provided by a bottom, metallic electrode disposed beneath the semiconductor body, and upon an electrically insulating layer which is supported upon the metallic substrate.

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Ferndale, MI, United States of America

Eric Akkashian