Intel Corporation

Eric A Karl

Zheng Guo

Clifford L Ong

George Shchupak

Smita Shridharan

Tali Kosinovsky

Mark T Bohr

Muhammad M Khellah

Jaydeep P Kulkarni

Iqbal Rajwani

Anupama Ambardar Thaploo

Pramod Kolar

Yong-Gee Ng

Kyung-Hoae Koo

Ian A Young

Dmitri E Nikonov

Stefan Rusu

Dinesh Somasekhar

Yih Wang

Kevin X Zhang

Fatih Hamzaoglu

Donald W Nelson

Cyrille Dray

Uddalak Bhattacharya

Gururaj Shamanna

Yu-Lin Chao

Hyunwoo Nho

Gordon Carskadon

Xiaofei Wang

Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.

Internal node jumper for memory bit cells

Uniform layouts for SRAM and register file bit cells are described. In an example, an integrated circuit structure includes a six transistor (6T) static random access memory (SRAM) bit cell on a substrate. The 6T SRAM bit cell includes first and second active regions parallel along a first direction of the substrate. First, second, third and fourth gate lines are over the first and second active regions, the first, second, third and fourth gate lines parallel along a second direction of the substrate, the second direction perpendicular to the first direction.

Uniform layouts for SRAM and register file bit cells

Systems and methods for precision writing of weight values to a memory capable of storing multiple levels in each cell are disclosed. Embodiments include logic to compare an electrical parameter read from a memory cell with a base reference and an interval reference, and stop writing once the electrical parameter is between the base reference and the base plus the interval reference. The interval may be determined using a greater number of levels than the number of stored levels, to prevent possible overlap of read values of the electrical parameter due to memory device variations.

Precise writing of multi-level weights to memory devices for compute-in-memory

Some embodiments include apparatuses having non-volatile memory cells, each of the non-volatile memory cells to store more than one bit of information; data lines, at most one of the data lines electrically coupled to each of the non-volatile memory cells; a circuit including transistors coupled to the data lines, the transistors including gates coupled to each other; and an encoder including input nodes and output nodes, the input nodes to receive input information from the data lines through the transistors, and the output nodes to provide output information having a value based on a value of the input information.

Multi-bit read-only memory device

An apparatus is provided which comprises: an interconnect comprising poly extending in a first direction; a power supply rail extending in a second direction, wherein the second direction is parallel to the first direction; and a memory array organized in rows and columns, wherein the rows are orthogonal to the columns, wherein the first and second directions are parallel to the rows of the memory array, wherein the memory array comprises bit-cells (e.g., 6T SRAM bit-cells) that are organized such that there are no gap bit-cells in the array.

Row based memory write assist and active sleep bias

Techniques and mechanisms for exchanging signals with one or more transistors at a front side of a semiconductor substrate. In an embodiment, an integrated circuit include a cell&#x2014;such as a static random access memory (SRAM) cell&#x2014;comprising transistor structures variously disposed in or on a first side of a substrate. After fabrication of such transistor structures, substrate material may be thinned to expose a second side of the substrate, opposite the first side. A first interconnect and a second interconnect are coupled each to exchange a signal or a voltage. In another embodiment, respective portions of the first interconnect and the second interconnect extend on opposite sides of the substrate, wherein the first side and the second side each extend between such interconnect portions. Positioning of interconnect structures on opposite sides of the substrate allow for performance improvements due to low interconnect resistances.

Architecture to communicate signals for operating a static random access memory

Described is an apparatus which comprises: a memory; a first power supply node to receive a first power supply; a second power supply node coupled to the memory to provide the memory with second power supply; a circuit coupled to the first and second power supply nodes, the circuit operable to dynamically modulate droop in the second power supply by adaptively adjusting signal characteristics of a write assist pulse.

Apparatus for adaptive write assist for memory

A static random-access memory is described. The SRAM includes a storage cell and a voltage supply to supply the storage cell with a reduced voltage during a write operation. The SRAM cell includes a first pass gate and a second pass gate. A first resistor is coupled between the first pass gate and a first side of the storage cell. A second resistor is coupled between the second pass gate and a second side of the storage cell.

Operation aware auto-feedback SRAM

Embodiments include apparatuses, methods, and systems related to an assist circuit that may be coupled to one or more components of a memory system to selectively lower a supply voltage that is delivered to the component. For example, the assist circuit may be coupled to a plurality of bitcells (e.g., register file bitcells). The assist circuit may selectively lower the supply voltage delivered to the bitcells during at least a portion of a write operation and/or during an inactive state of the bitcells. Additionally, or alternatively, the assist circuit may be coupled to a read circuit to selectively lower the supply voltage delivered to the read circuit during an inactive state of the read circuit. The assist circuit may include a control transistor coupled in parallel with one or more diodes between a main supply rail and a supply node of the bitcells and/or read circuit.

Assist circuit for memory

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Portland, OR, United States of America

Eric A Karl