Massachusetts Institute of Technology

Eric A Dauler

Rabindra N Das

Karl Kimon Berggren

Andrew J Kerman

Vikas Anant

Joel K W Yang

A cryogenic electronic package includes a circuitized substrate, an interposer, a superconducting multichip module (SMCM) and at least one superconducting semiconductor structure. The at least one superconducting semiconductor structure is disposed over and coupled to the SMCM, and the interposer is disposed between the SMCM and the substrate. The SMCM and the at least one superconducting semiconductor structure are electrically coupled to the substrate through the interposer. A cryogenic electronic assembly including a plurality of cryogenic electronic packages is also provided.

Cryogenic electronic packages and assemblies

A cryogenic electronic package includes a first superconducting multi-chip module (SMCM), a superconducting interposer, a second SMCM and a superconducting semiconductor structure. The interposer is disposed over and coupled to the first SMCM, the second SMCM is disposed over and coupled to the interposer, and the superconducting semiconductor structure is disposed over and coupled to the second SMCM. The second SMCM and the superconducting semiconductor structure are electrically coupled to the first SMCM through the interposer. A method of fabricating a cryogenic electronic package is also provided.

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

A cryogenic electronic package includes at least two superconducting and/or conventional metal semiconductor structures. Each of the semiconductor structures includes a substrate and a superconducting trace. Additionally, each of the semiconductor structures includes a passivation layer and one or more under bump metal (UBM) structures. The cryogenic electronic package also includes one or more superconducting and/or conventional metal interconnect structures disposed between selected ones of the at least two superconducting semiconductor structures. The interconnect structures are electrically coupled to respective ones of the UBM structures of the semiconductor structures to form one or more electrical connections between the semiconductor structures. A method of fabricating a cryogenic electronic package is also provided.

Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages

A multi-element optical detector includes a plurality of optical detector elements capable of producing an output signal having information about the state of an incident electromagnetic radiation as a function of time. An active region includes a photosensitive region of one of the optical detector elements separated in part or in whole from the photosensitive region of at least one other optical detector element by a distance less than the wavelength of the electromagnetic radiation that the optical detector elements are being used to detect.

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Acton, MA, United States of America

Eric A Dauler