Infineon Technologies Ag

Infineon Technologies Dresden Gmbh & Co . Kg

Qimonda Ag

Infineon Technologies LLC

Erhard Landgraf

Franz Hofmann

Michael Specht

Richard Johannes Luyken

Thomas Schulz

Emanuel Stoicescu

Steffen Bieselt

Claus Dahl

Matthias Boehm

Sebastian Pregl

Stefan Jahn

Janis Weidenauer

Franz Kreupl

Dirk Meinhold

Henning Feick

Michael Weber

Wolfgang Rösner

Dmitri Alex Tschumakow

Wolfgang Hönlein

Stephan Gerhard Albert

Johannes Kretz

Matthias Rose

Thomas Bertrams

Andrew Graham

Andreas Pribil

Steffen Rothenhaeusser

Matthias Goldbach

Bernhard Winkler

Wolfgang Roesner

Christian Pacha

Sven Schmidbauer

Tobias Mono

Michael Stadtmueller

Wolfgang Rosner

Jörg Radecker

Victor Popescu-Stroe

Johannes Luyken

Moritz Haupt

Constantin Crisu

Daniel Koehler

Hannes Luyken

Martin Staedele

Uwe Fakesch

Claudia Hengst

An ultrasonic touch sensor includes a touch structure configured to receive a touch; a transmitter arrangement configured to transmit one or more ultrasonic transmit waves toward the touch structure; a receiver arrangement configured to receive ultrasonic reflected waves produced by reflections of the one or more ultrasonic transmit waves and generate a plurality of measurement signals representative of the ultrasonic reflected waves; and a measurement circuit configured to measure a degree of variation of a plurality of measurement signals, compare the degree of variation with a detection threshold, and determine whether a no-touch event or a touch event has occurred at the touch structure based on whether the degree of variation satisfies the detection threshold.

Water droplet rejection for capacitive micromachined ultrasonic transducer (CMUT) touch sensing based on spatial distribution of CMUT receivers

A sensor system with a first semiconductor die part and with a second semiconductor die part is proposed, wherein the first semiconductor die part has a microelectromechanical sensor element, wherein the second semiconductor die part covers the microelectromechanical sensor element, wherein the second semiconductor die part has a via for electrically contacting the microelectromechanical sensor element, in particular directly. A method for producing a sensor system is also proposed.

Sensor system with a microelectromechanical sensor element and method for producing a sensor system

A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

Pressure sensor devices and methods for manufacturing pressure sensor devices

A touch sensor includes a touch structure arranged over an ultrasound port; an array of transceiver transducers arranged inside the ultrasound port and configured to generate a main directivity lobe directed at a touch interface, receive an ultra-sonic reflected wave produced at least in part by internal reflection of the main directivity lobe at the touch interface, and convert the ultra-sonic reflected wave into at least one measurement signal; a controller configured to modulate a directivity characteristic of the main directivity lobe by selectively activating the transmit transducers; and a receiver circuit configured to determine a size of a contact patch of a touch event present at the touch interface based on the at least one measurement signal and the directivity characteristic of the main directivity lobe, and determine an amount of contact force applied during the touch event based on the size of the contact patch.

Force sensing in touch sensor by directivity control of transmit transducers

Examples provide for an apparatus, method, and computer program for comparing the output of sensor cells in an arrangement of sensor cells in an area A, including a set of at least two measurement units. A measurement unit includes at least two sensor cells, wherein at least one sensor cell of at least one measurement unit includes a sensitive sensor cell, which is sensitive with respect to a measured quantity. The sensor cells are intermixed with each other. The apparatus further includes means for selecting output signals of sensor cells of the arrangement and means for determining a measured quantity or determining an intact sensor cell by comparing output signals of different measurement units.

Apparatus, method, and computer program for comparing the output of sensor cells

A method produces a micromechanical sensor element having a first electrode and a second electrode, wherein electrode wall surfaces of the first and the second electrodes are situated opposite one another in a first direction and form a capacitance, wherein one of the first electrode or the second electrode is movable in a second direction, in response to a variable to be detected, and a second one of the first electrode and the second electrode is fixed. The method includes producing a cavity in a semiconductor substrate, the cavity being closed by a doped semiconductor layer; producing the first and the second electrodes in the semiconductor layer, including modifying the electrode wall surface of the first electrode in order to have a smaller extent in the second direction than the electrode wall surface of the second electrode.

Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element

A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

A micro-electro-mechanical sensor comprises a first substrate comprising an element movable with respect to the first substrate and a second substrate comprising a first contact pad and a second contact pad. The first substrate is bonded to the second substrate such that a movement of the element changes a coupling between the first contact pad and the second contact pad.

Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor

A micromechanical sensor includes a first and a second capacitive sensor element each having a first and a second electrode, wherein electrode wall surfaces of the first electrode and the second electrode are situated opposite one another in a first direction and form a capacitance, wherein the first electrodes are movable in a second direction, which is different than the first direction, in response to a variable to be detected, and the second electrodes are stationary. The electrode wall surface of the first electrode of the first sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the second electrode of the first sensor element. The electrode wall surface of the second electrode of the second sensor element has a smaller extent in the second direction than the opposite electrode wall surface of the first electrode of the second sensor element.

According to various embodiments, a semiconductor structure may include: a first source/drain region and a second source/drain region; a body region disposed between the first source/drain region and the second source/drain region, the body region including a core region and at least one edge region at least partially surrounding the core region; a dielectric region next to the body region and configured to limit a current flow through the body region in a width direction of the body region, wherein the at least one edge region is arranged between the core region and the dielectric region; and a gate structure configured to control the body region; wherein the gate structure is configured to provide a first threshold voltage for the core region of the body region and a second threshold voltage for the at least one edge region of the body region, wherein the first threshold voltage is less than or equal to the second threshold voltage.

Semiconductor structure and a method for processing a carrier

A transistor component includes an active transistor region arranged in the semiconductor body. And insulation region surrounds the active transistor region in the semiconductor body in a ring-shaped manner. A source zone, a drain zone, a body zone and a drift zone are disposed in the active transistor region. The source zone and the drain zone are spaced apart in a lateral direction of the semiconductor body and the body zone is arranged between the source zone and the drift zone and the drift zone is arranged between the body zone and the drain zone. A gate and field electrode is arranged over the active transistor region. The dielectric layer has a first thickness in a region near the body zone and a second thickness in a region near the drift zone.

Lateral transistor component and method for producing same

A fin field effect transistor arrangement comprises a substrate and a first fin field effect transistor on and/or in the substrate. The first fin field effect transistor includes a fin in which a channel region is formed between a first source/drain region and a second source/drain region and above which a gate region is formed. A second fin field effect transistor is provided on and/or in the substrate including a fin in which a channel region is formed between a first source/drain region and a second source/drain region and above which a gate region is formed. The second fin field effect transistor is arranged laterally alongside the first fin field effect transistor, wherein a height of the fin of the first fin field effect transistor is greater than a height of the fin of the second fin field effect transistor.

Fin field effect transistor arrangement and method for producing a fin field effect transistor arrangement

The present invention relates to a transistor comprising a gate channel area and a gate stack having mechanical stress arranged on the gate channel area.

Method for manufacturing an integrated circuit including a transistor

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Dresden, Germany

Erhard Landgraf