Applied Materials, Inc.

Applied Materials Israel Limited

Erez Ravid

Yehuda Cohen

Gadi Greenberg

Doron Meshulach

Shimon Levi

Efrat Rosenman

Kobi Kan

Vladimir Mikolinsky

Ido Holcman

Jeong Ho Yeo

A method for characterizing a surface of a sample object, the method including dividing the surface into pixels which are characterized by a parameter variation, and defining blocks of the surface as respective groups of the pixels. The method further includes irradiating the pixels in multiple scans over the surface with radiation having different, respective types of polarization, and detecting returning radiation from the pixels in response to each of the scans. For each scan, respective block signatures of the blocks are constructed, in response to the returning radiation from the group of pixels in each block. Also for each scan, a block signature variation using the respective block signatures of the blocks is determined. In response to the block signature variation, one or more of the types of polarization for use in subsequent examination of a test object are selected.

High throughput across-wafer-variation mapping

A system for on-the-fly automatic defect classification (ADC) in a scanned wafer. The system includes a light source illuminating the scanned wafer so as to generate an illuminating spot incident on the wafer. Sensor collecting light scattered from the spot by the at least two spaced apart detectors, and processor analyzing the collected light so as to detect defects in the wafer and classifying the defects into distinct defect types.

On-the-fly automatic defect classification for substrates using signal attributes

Growing community of inventors

Jerusalem, Israel

Erez Ravid