Ii-vi Delaware, Inc.

Er-Chien Wang

Glenn Wayne Baxter

Nitesh Gulati

Wei Chien Choo

Described herein is a method () of forming a spatial light modulator device (). The method () comprises, at step (), providing a planar silicon substrate. At step (), a patternable material () is deposited onto a bonding surface () of the silicon substrate (). At step (), the patternable material () is formed into a predefined patterned structure on the bonding surface (). At step (), an upper layer substrate () is applied to the predefined patterned structure. At step (), a bonding process is performed such that the predefined patterned structure forms a hermetic seal between the silicon substrate () and the upper layer substrate (), defining a cavity between the silicon substrate () and the upper layer substrate () to contain a light modulating material ().

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Canberra, Australia

Er-Chien Wang