International Business Machines Corporation

Globalfoundries U.S. Inc.

Globalfoundries Inc.

Marvell Asia Pte., Ltd.

Globalfoundries Singapore Pte. Ltd.

Ephrem G Gebreselasie

Alain F Loiseau

Andreas Daniel Stricker

Robert J Gauthier, Jr

Johnatan A Kantarovsky

Vibhor Jain

Icko E T Iben

Joseph M Lukaitis

Steven H Voldman

Yun Shi

Renata A Camillo-Castillo

Richard A Phelps

Yves T Ngu

Erik Mattias Dahlstrom

Siva P Adusumilli

Ahmed Y Ginawi

Richard A Poro, Iii

Jed Hickory Rankin

Ping-Chuan Wang

Wolfgang Sauter

Zhong-Xiang He

William Thomas Motsiff

Rajendran Krishnasamy

Mark Levy

William R Tonti

Steven M Shank

Robert Russell Robison

Douglas Duane Coolbaugh

Chandrasekharan Kothandaraman

Souvick Mitra

Herbert Lei Ho

Robert Mark Rassel

Steven J Bentley

Ebenezer E Eshun

Santosh Sharma

Michel J Abou-Khalil

Michael Joseph Zierak

Mujahid Muhammad

Kenneth Jay Stein

Deok-Kee Kim

Hongwen Yan

Dan Moy

John Matthew Safran

Kimball M Watson

Shunhua Thomas Chang

Norman Whitelaw Robson

Mickey H Yu

Anindya Nath

Xiangxiang Lu

Sagar Premnath Karalkar

Richard Antoine Poro

Yves Ngu

Mark David Levy

Structures for an electrostatic discharge protection device and methods of forming same. The structure comprises a first well and a second well in the semiconductor substrate. The first and second wells have a first conductivity type. The structure further comprises a third well and a fourth well in the semiconductor substrate. The third and fourth wells have a second conductivity type, the third well includes a portion that overlaps with the first well, and the fourth well includes a portion that overlaps with the second well.

Electrostatic discharge protection devices

Embodiments of the disclosure provide a circuit structure including an electrically programmable fuse (efuse) and lateral bipolar transistor. A structure of the disclosure includes a lateral bipolar transistor within a semiconductor layer and over a substrate. An insulator layer is over a portion of the semiconductor layer. An efuse structure is within a polycrystalline semiconductor layer and over the insulator layer. The efuse structure is over a current path through the lateral bipolar transistor.

Electrically programmable fuse over lateral bipolar transistor

Embodiments of the disclosure provide an electrically programmable fuse (efuse) over crystalline semiconductor material. A structure according to the disclosure includes a plurality of crystalline semiconductor layers. Each crystalline semiconductor layer includes a compound material. A metallic layer is on the plurality of crystalline semiconductor layers. The metallic layer has a lower resistivity than an uppermost layer of the plurality of crystalline semiconductor layers. A pair of gate conductors is on respective portions of the metallic layer. The metallic layer defines an electrically programmable fuse (efuse) link between the gate conductors.

Electrically programmable fuse over crystalline semiconductor materials

The present disclosure relates generally to structures in semiconductor devices and methods of forming the same. More particularly, the present disclosure relates to high electron mobility transistor (HEMT) devices having a silicided polysilicon layer. The present disclosure may provide an active region above a substrate, source and drain electrodes in contact with the active region, a gate above the active region, the gate being laterally between the source and drain electrodes, a polysilicon layer above the substrate, and a silicide layer on the polysilicon layer. The active region includes at least two material layers with different band gaps. The polysilicon layer may be configured as an electronic fuse, a resistor, or a diode.

High electron mobility transistor devices having a silicided polysilicon layer

The present disclosure relates to semiconductor structures and, more particularly, to an eFuse and gate structure on a triple-well and methods of manufacture. The structure includes: a substrate comprising a bounded region; a gate structure formed within the bounded region; and an eFuse formed within the bounded region and electrically connected to the gate structure.

Efuse inside and gate structure on triple-well region

An electrical fuse (e-fuse) includes a fuse link including a silicided semiconductor layer over a dielectric layer covering a gate conductor. The silicided semiconductor layer is non-planar and extends orthogonally over the gate conductor. A first terminal is electrically coupled to a first end of the fuse link, and a second terminal is electrically coupled to a second end of the fuse link. The fuse link may be formed in the same layer as an intrinsic and/or extrinsic base of a bipolar transistor. The gate conductor may control a current source for programming the e-fuse. The e-fuse reduces the footprint and the required programming energy compared to conventional e-fuses.

Non-planar silicided semiconductor electrical fuse

The present disclosure relates to semiconductor structures and, more particularly, to electronic fuse (e-fuse) cells integrated with a bipolar device and methods of manufacture. The structure includes: a bipolar device comprising a collector region, a base region and an emitter region; and an e-fuse integrated with and extending from the emitter region of the bipolar device.

Electronic fuse (e-fuse) cells integrated with bipolar device

The present disclosure relates to an electrostatic discharge (ESD) clamp and, more particularly, to an ESD clamp with reduced off-state power consumption. The structure includes: one or more inverters connected to a timing circuit; a first transistor receiving an output signal from a last of the one or more inverters and an output signal from the timing circuit; a second transistor with its gate connected to the first transistor, in series; and a voltage node providing a separate voltage to a gate of the second transistor.

Electrostatic discharge clamp with reduced off-state power consumption

The disclosure provides an apparatus for preventing an integrated circuit (IC) structure from entering a latch-up mode. In an embodiment, the apparatus may include: a p-type substrate; an n-well within the p-type substrate; an n-type region within the p-type substrate, the n-type region being distinct from the n-well; a p-type region within the n-well; a power supply electrically coupled to the p-type region within the n-well; and a directional diode electrically coupling the power supply to the n-well in parallel with the p-type region. The directional diode biases a current flow from the power supply to the n-well, and the directional diode contacts the n-well distal to the p-type region.

Apparatus and method to prevent integrated circuit from entering latch-up mode

ESD protection circuitry that includes one, or more, of the following features, characteristics and/or advantages: (i) use of different 'diode types' (for example, Schottky type, PN type, p-type diode-connected field-effect transistor (FET) type, NFET type)) in a series-connected diode set (connected in series with respect to a device-under-protection) and a parallel-connected diode set (connected in parallel with respect to a device-under-protection and the series-connected diode set); (ii) a FET is connected in series with a target device such that the FET's gate can be turned on during normal operation and the FET's gate is resistively coupled to the FET's source; and/or (iii) two FETs are connected in series with a target device such both FETs gates can be turned on during normal operation, one FET's gate is resistively coupled to its source, and the other FET's gate is electrically coupled to its drain.

Method to protect sensitive devices from electrostatic discharge damage

The present disclosure relates to semiconductor structures and, more particularly, to electrostatic discharge (ESD) protection structures for eFuses. The structure includes an electrostatic discharge (ESD) protection structure operatively coupled to an eFuse, which is structured to prevent unintentional programming of the eFuse due to an ESD event originating at a source.

Electrostatic discharge protection structures for eFuses

A magneto-resistive (MR) sensor protection circuit is disclosed, for the protection of an MR sensor. The MR sensor may have a safe operating voltage range, a normal operating voltage range within the safe operating voltage range, and two terminals coupled to a read channel circuit, including a positive terminal and a negative terminal. The MR sensor protection circuit may have positive and negative protection threshold voltage ranges. The MR sensor protection circuit may also have a plurality of N-channel field-effect transistors (NFETs) that are coupled to the positive terminal and to the negative terminal, and configured to, in response to a voltage between the two terminals being within either the positive or the negative protection threshold voltage range, limit the voltage between the terminals by shunting current between the positive terminal and the negative terminal.

Electrostatic discharge protection for a magnetoresistive sensor

Growing community of inventors

South Burlington, VT, United States of America

Ephrem G Gebreselasie