Lg Chem, Ltd

Eon Seok Lee

Minsu Kim

Gi Dae Choi

Myong Jo Ham

Cheol-Hee Park

Jae Hyun Kim

Shin Hee Jun

Han Nah Jeong

Hyun Jin Lee

Kwon Il Choi

Eun Kyu Seong

ChangHun Yun

Worl Yong Kim

Sun Woo Kim

Youngjoo Kim

Chung Hae Park

Si Hwan Park

Soongin Kim

Provided is a thermoplastic resin composition, including (a) 100 parts by weight of a thermoplastic resin including 80-100% by weight of a base resin and 0-20% by weight of a reinforcing resin; (b) 2-60 parts by weight of linear carbon fibers having an average diameter of 1-15 μm; (c) 1-5 parts by weight of carbon nanofibrils having a BET specific surface area of 200-400 m/g; (d) 1-15 parts by weight of carbon nanoplates; and (e) 1-25 parts by weight of metal powder, a method of preparing the thermoplastic resin composition, and an injection-molded article manufactured using the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, e.g., impact strength, and also excellent conductivity, heat resistance, and electromagnetic wave shielding capacity, particularly high shielding efficiency against high-frequency electromagnetic waves, and thus can be used as automobile, electric, and electronic parts, and as a substitute for aluminum alloys and magnesium alloys.

Thermoplastic resin composition having excellent heat resistance and electromagnetic wave shielding capacity, method of preparing thermoplastic resin composition, and injection-molded article manufactured using thermoplastic resin composition

The present invention relates to a conductive concentrated resin composition including (a) 100 parts by weight of a base resin including 50 to 95% by weight of a polyamide resin, 2.5 to 20% by weight of a polar polymer, and 2.5 to 30% by weight of a non-polar polymer, (b) 10 to parts by weight of a carbon nanofibril, (c) 0.5 to 5 parts by weight of a carbon nanoplate, and (d) 0.5 to 4 parts by weight of nanoclay; a conductive polyamide resin composition including the conductive concentrated resin composition; a method of preparing the conductive concentrated resin composition; and a molded article including the conductive polyamide resin composition. When a polyamide alloy resin composition is prepared using the conductive concentrated resin composition of the present invention, compatibility between compositions and dispersion stability may be improved, thereby significantly increasing moisture stability while maintaining mechanical strength, conductivity, heat resistance, and appearance properties equal or superior to those of a conventional conductive polyamide alloy resin composition.

Conductive concentrated resin composition, conductive polyamide resin composition comprising conductive concentrated resin composition, method of preparing same and molded article

A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.

Polyphenylene sulfide resin composition, method of preparing polyphenylene sulfide resin composition, and injection-molded article manufactured using polyphenylene sulfide resin composition

The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.

Composition for forming conductive pattern and resin structure having conductive pattern

Provided are a polymer resin composition and a method of preparing the same. The polymer resin composition includes: a polymer resin; 0.01-10.0 parts by weight of flaky pigment particles having an inverse aspect ratio of 0.01-0.1 based on 100 parts by weight of the polymer resin; and 0.01-10.0 parts by weight of polyhedral pigment particles having an inverse aspect ratio of 0.300-0.999 based on 100 parts by weight of the polymer resin. Using the polymer resin composition, a polymer resin molded product having excellent appearance, i.e., having a uniform color even in resin flow lines or resin weld lines, and in which there is no degradation in the physical properties of the polymer resin contained therein can be manufactured at a low cost.

Polymer resin composition and method of preparing the same

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Daejeon, South Korea

Eon Seok Lee