Tpk Touch Solutions (xiamen) Inc.

Enshi Shi

Yau-Chen Jiang

Yanjun Xie

Bin Lai

Silu Yu

Hua Ding

The present disclosure relates to a touch technology, and more particularly, to a touch panel and a manufacturing method the same. A touch panel is provided, comprising an inductive electrode layer and a patterned protective layer covering the inductive electrode layer; wherein formative pattern of the patterned protective layer is identical to that of the inductive electrode layer. The present disclosure also provides a manufacturing method for touch panels. A touch panel and a manufacturing method the same are provided in the present disclosure, in which the patterned protective layer is used for covering the inductive electrode layer to isolate the inductive electrode layer from oxygen and overcome the influence of oxygen on the diamond resistance changes of conductive materials under the condition of high-temperature baking, thereby enhancing the accuracy of touch positions recognized by touch panel.

Touch panel and a manufacturing method thereof

The present disclosure provides a touch panel which at least comprises a sensing area, a conductive wire area, and earthing lines. The conductive wire area surrounds the sensing area and is electrically connected to the sensing area, and the conductive wire area comprises a first conductive wire area and a second conductive wire area. The earthing lines are set between the first conductive wire area and the second conductive wire area. The touch panel can efficiently shield signal crosstalk between the first conductive wire area and the second conductive wire area by setting the earthing lines between the first conductive wire area and the second conductive wire area, thereby reducing the influence of signal crosstalk on efficiency of the touch panel.

A touch panel having a shielding layer and a manufacturing method thereof is provided. A manufacturing method of the touch panel comprises the steps of forming a plurality of first conductive axes and a plurality of second conductive units on a substrate; covering the first conductive axes and the second conductive units with an insulating layer and exposing at least a partial set of second conductive units; and forming a plurality of bridging structures and a shielding layer on the insulating layer simultaneously, wherein the bridging structures electrically connect to the second conductive units. The proposed method allows the shielding layer to be formed during the formation of the bridging structures, thereby eliminating the step of forming the shielding layer separately through an independent process, which saves costs and time.

Growing community of inventors

Xiamen, China

Enshi Shi