Utac Headquarters Pte. Ltd.

Enrique Jr Sarile

Dzafir Bin Mohd Shariff

Seung Geun Park

Hua Hong Tan

Wedanni Linsangan Micla

Teddy Joaquin Carreon

Chee Kay Chow

Dennis Fernandez Tresnado

Mauro Jr Dionisio

Mario Arwin Fabian

Kian Soo Lim

Antonino Ii Milanes

Zhong Hai Wang

Thian Hwee Tan

Ming Koon Ang

Ronnie M De Villa

A semiconductor package is disclosed. The semiconductor package includes a substrate with a first surface, a second surface and sidewalls. The package also includes backside metallization (BSM) over the second surface of the substrate. The semiconductor package is devoid of metal debris.

Semiconductor packages and methods of packaging semiconductor devices

A semiconductor package which is free of metal debris from backside metallization (BSM) is disclosed. The semiconductor package is singulated by performing a saw street open process from the frontside of the wafer and then includes a singulation process using a plasma etch from the backside of the wafer with BSM. The singulation process results in metal debris free packages.

Semiconductor packages without debris

A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces. An encapsulant is disposed on the package substrate to cover exposed portions of the package substrate, die and bond wires and side surfaces of the protective cover, while leaving the first major cover surface exposed. The discontinuity enhances adhesion of the encapsulant to the protective cover.

Reliable semiconductor packages

Growing community of inventors

Singapore, Singapore

Enrique Jr Sarile