Asml Netherlands B.v.

Enno Van Den Brink

Klaus Simon

Andre Bernardus Jeunink

Henricus Wilhelmus Maria Van Buel

Bearrach Moest

Peter Ten Berge

Laurentius Johannes Adrianus Van Bokhoven

Yang-Shan Huang

Hoite Pieter Theodoor Tolsma

Joseph Consolini

Stefan Carolus Jacobus Antonius Keij

Stan Henricus Van Der Meulen

Keith Frank Best

Gerardus Johannes Joseph Keijsers

Federico La Torre

Christine Henriette Schouten

Hubertus Antonius Marinus Baijens

Cheng-Qun Gui

Franciscus Godefridus Casper Bijnen

Arnout Johannes Meester

Geoffrey Norman Phillipps

Maurice Anton Jaques Teuwen

Budiman Sutedja

Melle Cornelis Geers

Eric Maria Geelink

Johannes Theodoor De Smit

Richard Joseph Travers

Frederick William Hafner

Vinyu Greenlee

Adrianus Hubertus Henricus Van Dijk

A lithographic apparatus comprising a support structure constructed to support a patterning device and associated pellicle, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, and a projection system configured to project the patterned radiation beam onto a target portion of a substrate, wherein the support structure is located in a housing and wherein pressure sensors are located in the housing.

Lithographic method

A lithographic apparatus has a support structure constructed to support a patterning device and associated pellicle, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, and a projection system configured to project the patterned radiation beam onto a target portion of a substrate, wherein the support structure is located in a housing and wherein pressure sensors are located in the housing.

A method of forming images on a lithographic substrate is disclosed, the method including grouping a plurality of image regions together to form a combined image, determining or receiving a location at which the combined image is to be positioned on the substrate, calculating locations at which the image regions forming the combined image are to be positioned on the substrate, and using a lithographic apparatus to project the image regions at the calculated locations onto the substrate.

Lithographic apparatus, a device manufacturing method and a device manufactured thereby

According to one of the aspects of the present invention there is provided a substrate carrier arranged to hold a substrate in position using a vacuum, the vacuum being established in a sealed space created between the substrate carrier and the substrate.

Lithographic apparatus and method

An exposure apparatus is provided with a radiation source, a patterning structure, a projection system, a substrate, and a gas flushing system for removing gas from an area between the projection system and the substrate.

Radiation exposure apparatus comprising a gas flushing system

A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.

Lithographic apparatus and device manufacturing method

A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

Method and system for 3D alignment in wafer scale integration

Growing community of inventors

Eindhoven, Netherlands

Enno Van Den Brink