Skyworks Solutions, Inc.

Engin Ibrahim Pehlivanoglu

Hardik Bhupendra Modi

Anil K Agarwal

Eric Marsan

Adarsh Karan Jaiswal

Peihua Ye

Perihua Ye

Stack assembly for radio-frequency applications. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

Stack assembly for radio-frequency applications

Apparatus and methods for LNAs with mid-node impedance networks are provided herein. In certain configurations, an LNA includes a mid-node impedance circuit including a resistor and a capacitor electrically connected in parallel, a cascode device electrically connected between an output terminal and the mid-node impedance circuit, and a transconductance device electrically connected between the mid-node impedance circuit and ground. The transconductance device amplifies a radio frequency signal received from an input terminal. The LNA further includes a feedback bias circuit electrically connected between the output terminal and the input terminal and operable to control an input bias voltage of the transconductance device.

Apparatus and methods for low noise amplifiers with mid-node impedance networks

Stack assembly having electro-acoustic device. In some embodiments, a radio-frequency (RF) module can include a packaging substrate configured to receive a plurality of components, and an electro-acoustic device mounted on the packaging substrate. The RF module can further include a die having an integrated circuit and mounted over the electro-acoustic device to form a stack assembly. The electro-acoustic device can be, for example, a filter device such as a surface acoustic wave filter. The die can be, for example an amplifier die such as a low-noise amplifier implemented on a silicon die.

Stack assembly having electro-acoustic device

Apparatus and methods for low noise amplifiers (LNAs) are provided herein. In certain configurations, an LNA includes a mode control circuit that operates the LNA in one of a plurality of modes including a gain mode and a bypass mode, a gain circuit electrically connected between an input terminal and an output terminal and operable to amplify a radio frequency signal received from the input terminal in the gain mode, and a bypass circuit electrically connected between the input terminal and the output terminal and operable to bypass the gain circuit in the bypass mode. The bypass circuit includes a balun that provides a first amount of compensation for a difference in phase delay between the bypass circuit and the gain circuit, and the LNA further includes a phase compensation circuit operable to provide a second amount of compensation for the difference in phase delay.

Apparatus and methods for low noise amplifiers

Apparatus and methods for low noise amplifiers (LNAs) are provided herein. In certain configurations, an LNA includes a gain stage and a bypass stage electrically connected in parallel with one another between an input and an output. The bypass stage and the gain stage are selectively activated based on a mode of the LNA. For example, the gain stage provides inverting amplification to an input signal received at the input in a gain mode. Additionally, the bypass stage provides a low gain path from the input to the output in a bypass mode. Additionally, the bypass stage includes a balun that provides inversion to the bypass stage such that a phase delay through the bypass stage is similar to a phase delay of the gain stage.

Apparatus and methods for biasing low noise amplifiers are provided herein. In certain configurations, a low noise amplifier (LNA) includes an input, an output, a transconductance device, a cascode device, a bias current source, and a feedback bias circuit. The transconductance device generates an amplified signal by amplifying an input signal received at the input, and provides the amplified signal to the output via the cascode device. The bias current source generates a bias current that flows through the cascode device and the transconductance device. The feedback bias circuit provides feedback from the LNA's output to the LNA's input to control an input bias voltage of the transconductance device.

Apparatus and methods for biasing low noise amplifiers

Apparatus and methods for LNAs with mid-node impedance networks are provided herein. In certain configurations, an LNA includes an input, an output, a transconductance device, a cascode device, and a mid-node impedance network. The transconductance device generates an amplified signal by amplifying an input signal received at the input, and provides the amplified signal to the output via the cascode device. The mid-node impedance network is electrically connected between the transconductance device and the cascode device, and provides compensation for a parasitic capacitance of the gm device, thereby enhancing the LNA's performance.

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Costa Mesa, CA, United States of America

Engin Ibrahim Pehlivanoglu