Dow Global Technolgoies LLC

Dow Chemical (Malaysia) Sdn. Bhd.

Dow Chemical Imea Gmbh

Dow Chemical Sdn. Bhd.

Eng Kian Ma

Xiao Bing Yun

Prajwal Shah

Shashibhushan S Mishra

Wu Aik Yee

Hwee Lun Goh

Jeffrey J Li

Tamanna Duggal

Prashant Mogre

Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is oriented in the machine direction at a draw ratio greater than 1:1 and less than 4:1, and (b) a second multilayer film comprising a sealant layer and having a second film thickness, wherein the sealant layer of the first oriented film is sealed to the sealant layer of the second film, and wherein the total thickness of the sealed films is at least 5 percent greater than the sum of the first oriented film thickness and the second film thickness.

Sealed multilayer structures and packages comprising sealed multilayer structures

The present invention relates to a multilayer film comprising a skin layer comprising a anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a melting point in the range of from 50 to 89&#xb0; C., wherein the anhydride and/or carboxylic acid is present in an amount of from 0.02 to 0.3 percent by weight of the polyethylene based resin. The multilayer film further comprises a substrate layer comprising a resin selected from the group consisting of polypropylene or polyethylene terephthalate.

Film composition for paper thermal lamination application

A multi-layer structure comprising: (a) a skin layer comprising at least 50% by weight of an ethylene/&#x3b1;-olefin interpolymer composition (LLDPE) having a Comonomer Distribution Constant (CDC) in the range of from 45 to 400, and wherein the skin layer does not contain any migratory additive; (b) a metal layer disposed on the skin layer to form a metalized film; and (c) at least one substrate layer laminated onto the metallized film; wherein the ethylene/&#x3b1;-olefin interpolymer composition comprises (i) less than or equal to 100 percent by weight of the units derived from ethylene; and (ii) less than 30 percent by weight of units derived from one or more &#x3b1;-olefin comonomers is provided.

Metallized polyethylene film with improved metal adhesion

Growing community of inventors

Klang, Malaysia

Eng Kian Ma