Dow Global Technolgoies LLC

Dow Chemical (malaysia) Sdn. Bhd.

Dow Chemical Imea Gmbh

Dow Chemical Sdn. Bhd.

Eng Kian Ma

Xiao Bing Yun

Prajwal Shah

Shashibhushan S Mishra

Wu Aik Yee

Hwee Lun Goh

Jeffrey J Li

Tamanna Duggal

Prashant Mogre

The present invention relates to a multilayer film comprising a skin layer comprising a anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a melting point in the range of from 50 to 89&#xb0; C., wherein the anhydride and/or carboxylic acid is present in an amount of from 0.02 to 0.3 percent by weight of the polyethylene based resin. The multilayer film further comprises a substrate layer comprising a resin selected from the group consisting of polypropylene or polyethylene terephthalate.

Film composition for paper thermal lamination application

A multi-layer structure comprising: (a) a skin layer comprising at least 50% by weight of an ethylene/&#x3b1;-olefin interpolymer composition (LLDPE) having a Comonomer Distribution Constant (CDC) in the range of from 45 to 400, and wherein the skin layer does not contain any migratory additive; (b) a metal layer disposed on the skin layer to form a metalized film; and (c) at least one substrate layer laminated onto the metallized film; wherein the ethylene/&#x3b1;-olefin interpolymer composition comprises (i) less than or equal to 100 percent by weight of the units derived from ethylene; and (ii) less than 30 percent by weight of units derived from one or more &#x3b1;-olefin comonomers is provided.

Metallized polyethylene film with improved metal adhesion

Growing community of inventors

Klang, Malaysia

Eng Kian Ma