Altera Corporation

Eng C Cheah

Donald S Fritz

A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.

Thermally enhanced metal capped BGA package

An electronic package comprises a substrate, an electronic device mounted on the substrate, and a stiffener having a central hole on top of the electronic device. The electronic device has bond pads connected to the respective bond fingers on the substrate by bond wires. The stiffener and the substrate together define a space that houses the chip and the bond wires. A molding compound fills the space and covers the stiffener. A method of forming the electronic package comprises: providing the substrate; bonding the electronic device to the substrate; placing a stiffener on the substrate so that the stiffener and the substrate define a space for housing the electronic device; and injecting a molding compound into a central hole of the stiffener, the molding compound filling the space and overflowing out of the hole to cover the stiffener.

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San Jose, CA, United States of America

Eng C Cheah