United Microelectronics Corp.

En-Wei Tsui

Chung-Hsuan Wu

Nai-Ying Lo

Yung-Yu Yang

Chen-Hui Huang

Cheng-Hsien Chen

Chia-Feng Hsiao

Chen-Hsuan Hung

A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Wafer backside defect detection method and wafer backside defect detection apparatus

Growing community of inventors

Kaohsiung, Taiwan

En-Wei Tsui