National University of Singapore

Other

En-Tang Kang

Koon Gee Neoh

Thiam Beng Lim

Cheng Qiang Cui

Kuang Lee Tan

Der-Jang Liaw

Ching-Cheng Huang

Chunxiang Zhu

Thiam C Tan

Yen P Ting

Wei Huang

Jian Zhu

Sock Wee Ng

Jeyagowry T Sampanthar

Qi-Dan Ling

Daniel Siu-Hung Chan

Luping Zhao

Qidan Ling

Junfeng Zhang

Koon-Gee Neoh

Arthur Khoon Siah Ang

A compound comprises a polymeric chain with a repeat unit repeated more than 5 times. The repeat unit comprises conjugated first and second cyclic groups and a plurality of side groups each bonded to one of the cyclic groups. A side group bonded to the first cyclic group is an electron donor and a side group bonded to the second cyclic group is an electron acceptor, such that the compound is switchable between first and second electrical conductive states by application of an electric field to the compound. At least one of the side groups is selected so that the compound is soluble in an organic solvent. The compound may be used in films, memory cells, or electronic devices. A layer of the compound may be formed on a surface by dissolving the compound in an organic solvent, applying the solution to the surface, and then removing the solvent.

Soluble polymer with multi-stable electric states and products comprising such polymer

The invention relates to copolymer complexes of the formula (I): wherein [A-[B(C)]-D] denotes a single unit of the copolymer complex that is repeated n times, wherein n is an integer greater than one, and wherein the single unit comprises a conjugated backbone coordinated to a complex (C) comprising rare earth metal(s); x, y and z are numbers greater than zero such that x=y+z; A is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof; B is a functional ligand selected from the group consisting of: benzoic acid, 1,3-diphenylpropane-1,3-dione, 1,10-phenanthroline, 2,2-bipyridine, or derivatives thereof; and D is independently selected from a group consisting of: fluorene, carbazole, oxadiazole, triphenylamine or derivatives thereof.

Multi-functional copolymers comprising rare earth metal complexes and devices thereof

An electrically conductive polymeric article exhibiting enhanced conductivity including a polymeric material capable of exhibiting electrical conductivity; the polymeric material being rendered electrically conductive by treatment with UV or near UV irradiation in the presence of a viologen salt.

Photoinduced conversion of polyaniline from an insulating state to a conducting state

This invention relates to a method of enhancing the stability of electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, which comprises depositing on the electroactive polymers, the redox active materials, or the composite, a fluoropolymer by radio frequency sputtering. The invention also relates to electroactive polymers, redox active materials, or a composite comprising an electroactive polymer and a redox active material, that bears a radio frequency sputtered fluoropolymer coating.

Method of enhancing the stability of electroactive polymers and redox active materials

The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.

Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate

The present invention is directed to a method for the lamination of metals, and especially copper, to the surface of polyimides and derivatives of polyimides at temperatures substantially below the curing temperature of the imide polymers. More specifically, the invention is directed to a method for surface modification of polyimides and derivatives of polyimides by thermal graft copolymerization and interfacial polymerization with concurrent lamination of the metal of interest in the presence of an appropriate functional monomer. The process can be carried out under atmospheric conditions and either in the presence or the complete absence of an added polymerization initiator. The so laminated polyimide-metal interfaces exhibit T-peel adhesion strengths in excess of 16 N/cm. The adhesion strength also exceeds the fracture strength of polyimide films with a thickness of 75 &mgr;m.

Method for low temperature lamination of metals to polyimides

The present invention is directed to a process for imparting adhesive-free adhesion characteristics (i) between two polymer films, (ii) between a polymer film and a polymer fiber, and (iii) between the surface of a polymer fiber or film and a polymer matrix. The adhesive-free adhesion properties of the polymer film and fiber surfaces are introduced through a method for modification of a pre-activated polymer surface via near-UV-light induced or thermally-induced surface graft copolymerization with a functional monomer. The adhesive-free adhesion may be a result of dispersive interaction, chain entanglement, electrostatic interaction, ionic interaction, acid/base interaction, H-bonding and/or covalent bonding of the resulting grafted functional polymer(s) at the interface, or of the resulting grafted functional polymer and the polymer matrix.

Adhesive-free adhesion between polymer surfaces

The present invention is directed to a process for reducing the oxidation state of a metal by contacting an acidic solution of the metal with an electroactive polymer, and accumulating and recovering the metal. More particularly, the invention is directed to a method for recovering precious metals like gold, platinum, palladium, and gold-platinum alloys from acidic solution by contacting the solution with an electroactive polymer like polyaniline or polypyrrole.

Recovery of precious metals from acid solutions by N-containing

A simple chemical process for the simultaneous polymerization and oxidation of pyrrole, N-substituted pyrroles, and other heterocycles having five or six member rings by halogenic or organic electron acceptors. The polypyrrole-acceptor charge transfer complexes so produced are of high purity and are stable in the atmosphere, in the presence of moisture and at elevated temperatures. The conductivities of the complexes are controllable between 30 ohm.sup.-1 cm.sup.-1 and 10.sup.-3 ohm-1 cm-1, depending on the type of acceptor used and the process conditions.

Growing community of inventors

Singapore, Singapore

En-Tang Kang