Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Mediatek Incorporation

En-Hsiang Yeh

Chuei-Tang Wang

Monsen Liu

Tzu-Jin Yeh

Wen-Sheng Chen

An-Hsun Lo

Chung-Hao Tsai

Lai Wei Chih

Chen-Hua Douglas Yu

Jeng-Shien Hsieh

Garming Liang

Chen-Shien Chen

Chih-Hua Chen

Hsu-Hsien Chen

Simon Chai

Hsiang-Hui Chang

Hsueh-Kun Liao

Tsung-Ling Li

Chia-Ming Liang

Chieh-Hung Chen

Chia-Huang Fu

Zong-You Li

Chung-Ho Chai

Disclosed is an amplifying circuit and method. In one embodiment, an amplifying circuit, includes: a common-gate (CG) amplifier, wherein the CG amplifier comprises a first transistor, wherein source terminal and body terminal of the first transistor is coupled together through a first resistor.

Method and circuit to isolate body capacitance in semiconductor devices

A low noise amplifier (LNA) includes a pair of n-type transistors, each configured to provide a first transconductance; a pair of p-type transistors, each configured to provide a second transconductance; a first pair of coupling capacitors, cross-coupled between the pair of n-type transistors, and configured to provide a first boosting coefficient to the first transconductance; and a second pair of coupling capacitors, cross-coupled between the pair of p-type transistors, and configured to provide a second boosting coefficient to the second transconductance, wherein the LNA is configured to use a boosted effective transconductance based on the first and second boosting coefficients, and the first and second transconductances to amplify an input signal.

Wireless receiver

A power amplifier structure includes at least one power amplifier circuit. The power amplifier circuit includes a transistor of a first type connected in series with a transistor of a second type connected between the same voltage supply. In a non-limiting nonexclusive example, an n-type transistor is connected in series with a p-type transistor connected between Vdd. The power amplifier structure can include two amplifier circuits configured in a differential amplifier structure. The differential amplifier structure includes two amplifier circuits operably connected in parallel between the same voltage supply.

Power amplifiers

A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.

Method of embedding low-k materials in antennas

A method includes switching a receiver path network of a front-end module to a first matching mode in a receive mode. The method further includes switching a transmitter path network of the front-end module to a first resonance mode in the receive mode. The method further includes switching the transmitter path network to a second matching mode in a transmit mode. The method further includes switching the receiver path network to a second resonance mode in the transmit mode.

Method of using integrated transmitter and receiver front end module

An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.

Through-vias and methods of forming the same

A semiconductor device includes: a polygonal inductive device disposed on a first layer on a substrate, the polygonal inductive device including a first line portion; a first conductive line disposed on a second layer on the substrate; a second conductive line disposed on a third layer on the substrate; and a first conductive via arranged to electrically couple the second conductive line to the first conductive line; wherein the first layer is different from the second layer and the third layer, the first conductive line is electrically connected to a reference voltage, and the first conductive line crosses the first line portion viewing from a top of the semiconductor device.

Semiconductor device with polygonal inductive device

An antenna apparatus comprises a semiconductor die in a molding compound layer, a first through via is between a sidewall of the semiconductor die and a sidewall of the molding compound layer and an antenna structure over the molding compound layer, wherein a first portion of the antenna structure is directly over a top surface of the semiconductor die and a second portion of the antenna structure is directly over a top surface of the first through via.

Antenna apparatus and method

The measurement method includes operations of applying a first gate bias voltage to a gate terminal of a first transistor that is included in a radio frequency (RF) power amplifier during a direct current (DC) measurement period, wherein the first transistor operates in a linear operation mode during the DC measurement period; measuring a first drain-source voltage of the first transistor and a current flowing through the first transistor via a connection node during the DC measurement period; applying a second gate bias voltage and a drain bias voltage to a gate terminal and a drain terminal of a second transistor that is electrically connected to the first transistor via the connection node; and measuring a DC value of the second transistor via the connection node during the DC measurement period.

Measurement method using radio frequency power amplifier

In a communication system, a communication terminal device transmits and receives RF signals frequently. Subsequent to an antenna of the communication terminal device, the communication terminal device includes a radio frequency switch (also referred to as transmit/receive (T/R) switch) that switches between two states at a high frequency, where one state is for receiving RF signal and other state for transmitting RF signal. In the exemplary embodiments of the disclosure, a complementary metal-oxide-semiconductor (CMOS) switch is provided, where the CMOS switch is deigned to have a high reliability by coupling a body of a transistor of the CMOS switch to a bias voltage through a switch, where the insertion loss and isolation are improved for the operation of the CMOS switch.

Radio frequency switch circuit

A method includes placing a device die and a pre-formed dielectric block over a first carrier, encapsulating the device die and the pre-formed dielectric block in an encapsulating material, grinding a top side of the encapsulating material to expose the top side of the pre-formed dielectric block, removing the carrier from the encapsulating material, the pre-formed dielectric block, and the device die to reveal a bottom side of the pre-formed dielectric block, and forming a ground panel, a feeding line, and a patch on the encapsulating material. The ground panel, the feeding line, the patch, and the pre-formed dielectric block form a patch antenna.

Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas

A wireless transmitter includes a an amplifier; and a switchable transformer, coupled to the amplifier, wherein the amplifier is configured to be coupled to the switchable transformer in first and second configurations, wherein the first configuration causes the amplifier to provide a first output impedance to the switchable transformer, and wherein the second configuration causes the amplifier to provide a second output impedance to the switchable transformer, the first and second output impedances being different from each other.

Growing community of inventors

Hsin-Chu, Taiwan

En-Hsiang Yeh