Ut-battelle, Inc.

Emre Gurpinar

Burak Ozpineci

Md Shajjad Chowdhury

Raj Sahu

Shajjad Chowdhury

A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.

Heat sink system

A capacitor packaging having a central termination and three or more capacitors (or groups of capacitors) arranged about the central termination. The electrical flow paths between the termination and the capacitors or groups of capacitors are of substantially the same length. The capacitors or groups of capacitors may be arranged in a generally circular pattern with the termination centered on the center. The termination may include first and second terminals. The capacitors may be mounted to a printed circuit board ('PCB') with traces on opposite surfaces of the PCB providing electrical flow paths from the terminals to opposite legs of the capacitors. The capacitor packaging may include a primary PCB with a first circular arrangement of capacitors and a secondary PCB with a second circular arrangement of capacitors. The capacitors may be sandwiched between the PCBs with the second arrangement of capacitors disposed concentrically inwardly of the first arrangement.

High-performance capacitor packaging for next generation power electronics

A power module is provided with reduced power and gate loop inductance. The power module may be configured in a multi-layer manner with one or more organic substrates.

Growing community of inventors

Oak Ridge, TN, United States of America

Emre Gurpinar